A precision grinding device and parameter determination method for plane local high point removal

Abstract

The invention belongs to the technical field of precise machining and relates to a precise grinding device for the local plane high areas and a parameter determining method. The device comprises a motor shell, a damping washer, a motor, a connecting block, a transmission block, a dense ball bearing, a reference block, an eccentric grinding block, a wool felt seal ring, a precise steel ball and a pressure spring. According to the precise plane grinding device provided by the invention, the flat area around the high points on the surface of a workpiece is used as the reference, and the high points are removed through the grinding process. In the grinding device, the eccentric grinding block is used as a grinding head, non-uniform abrasion of the grinding block is reduced, and the precision of the working surface of the grinding block is improved; a bearing structure composed of a T-shaped dense ball shaft sleeve is adopted, and through the high-precision rotation and the axial limiting function of the eccentric grinding block, excessive grinding of the high point areas is prevented; and the device has the advantages of being simple in structure, convenient to operate and high in grinding accuracy and has the advantage that the eccentric grinding block can be replaced, and the device can meet the requirement for ultra-high precision plane grinding and is good in market application prospect and popularization value.

Description

technical field [0001] The invention belongs to the technical field of precision machining, and relates to a precision grinding device and a parameter determination method for removing local high points of a plane. Background technique [0002] Grinding is an ultra-precision machining process, which is mainly used for ultra-precision machining of surfaces composed of simple geometric elements such as planes, cylinders, and spheres; at present, the flatness of plane grinding can generally reach 0.2-0.5 μm; The roundness of surface grinding can generally reach 0.2-0.5 μm, and the cylindricity can generally reach 0.5-1 μm. [0003] In the process of plane grinding, due to the influence of factors such as the grinding process, the change of ambient temperature and the inhomogeneity of the workpiece material, it is difficult to improve the flatness of the workpiece surface after it has been processed to a certain extent. The process of flattening the workpiece surface is also a ...

AI Technical Summary

Problems solved by technology

The ultra-precision point-by-point removal grinding process based on measurement is adopted. If it is not properly controlled, the high point will become a low point, which will affect the improvement of the workpiece plane accuracy.

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