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Method of manufacturing molded semiconductor package with optical detection features

A technology of semiconductors and packages, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.

Active Publication Date: 2020-05-19
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, selective etching is limited to leadframe suppliers and requires a suitable anisotropic copper etchant

Method used

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  • Method of manufacturing molded semiconductor package with optical detection features
  • Method of manufacturing molded semiconductor package with optical detection features
  • Method of manufacturing molded semiconductor package with optical detection features

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] According to the embodiments described herein, such as QFN (quad-flat no-leads), DFN (dual-flat no-leads), TSNP (Thin Small Non Leaded Package) A leadless molded semiconductor package is fabricated from a molded substrate and has optical inspection features, also referred to herein as lead end inspection (LTI) features, at the edge of the individual molded package. Leadless semiconductor packaging technology, also commonly referred to as MLP (micro leadframe: micro leadframe) and SON (small-outline no leads: small-outline no leads), is a method for connecting integrated circuits (IC: integrated circuit) Surface mount technology to the surface of a printed circuit board (PCB: printed circuit board) without through-hole connections. The leadless semiconductor packages described herein are fabricated by singulating a molded semiconductor substrate into individual molded packages using a single-step sawing process, followed by plating of the LTI features. In this way, the ...

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PUM

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Abstract

A molded semiconductor package includes a mold compound having opposing first and second main surfaces and an edge extending between the first and second main surfaces. A semiconductor die is embedded in the mold compound. A plurality of metal pads embedded in the mold compound are electrically connected to the semiconductor die. The metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound. The metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound. The faces of the metal pads uncovered by the mold compound are plated. The side face of each metal pad disposed around the periphery of the molded package is recessed inward from the edge of the mold compound. A corresponding manufacturing method is also described.

Description

technical field [0001] The present application relates to molded semiconductor packages, and more particularly to molded semiconductor packages having optical detection features. Background technique [0002] Many types of molded semiconductor packages have so-called LTI (leadtip inspection) features at the edge of the molded package to allow inspection of the joints between the metal pads of the molded package or The bond is optically inspected, and the molded semiconductor package has a substrate, such as a circuit board, to which the molded package is attached. The LTI feature is the portion of the metal pad at the periphery of the molded package that extends to the edge of the molded package and is not covered by the molding compound, thus allowing optical inspection from the side. [0003] A single molded package is typically formed from a molded substrate including a plurality of semiconductor chips and metal pads electrically connected to the chips. The semiconducto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56H01L23/31H01L23/495
CPCH01L21/50H01L21/561H01L23/3121H01L23/49579H01L23/49582H01L23/49541H01L23/49548H01L21/6836H01L21/78H01L24/06H01L23/293H01L24/03H01L23/49503H01L2224/03825H01L2224/05655H01L2224/48247H01L2224/32245H01L2224/0381H01L2224/73265H01L2224/16245H01L2924/00014H01L2224/48091H01L2924/00012H01L2924/181
Inventor H·H·张S·L·吴S·K·李F·M·卢姆M·穆罕默特萨努西M·C·吴A·索里亚诺
Owner INFINEON TECH AG