Mechanical arm, semiconductor processing equipment and mechanical arm working state detection method

Abstract

The invention provides a mechanical arm, semiconductor processing equipment and a mechanical arm working state detection method. The mechanical arm comprises an arm, and a finger and a strain sensor arranged at one end of the arm, wherein a gas access is formed in the arm; one end of the gas access extends to the lower surface of the finger; by vacuumizing the gas access, a wafer can be adsorbed on the lower surface of the finger; the strain sensor is used for detecting the strain quantity of the arm; and based on the strain quantity of the arm, whether the mechanical arm suffers from an abnormal condition or not in transporting and wafer taking-placing processes, and whether the wafer in transporting has a problem or not can be judged. By virtue of the mechanical arm provided by the invention, whether an abnormal condition occurs or not in transporting and wafer taking-placing processes and whether the wafer in transporting has a problem or not can be judged accurately in time.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a manipulator, semiconductor processing equipment and a method for detecting the working state of the manipulator. Background technique [0002] Manipulators are usually used in semiconductor processing steps such as grinding, polishing, etching, diffusion, deposition, assembly, packaging, and testing to transport and position semiconductor wafers. In the manipulator of semiconductor equipment, the method of negative pressure suction is mainly used to take the chip, that is, the semiconductor chip is adsorbed on the quartz or ceramic finger by the principle of the suction cup, and the semiconductor is transported by the action of stretching, rotating and lifting of the mechanical arm. wafer. [0003] figure 1 It is a cross-sectional view of an existing manipulator. see figure 1 , the manipulator includes an arm 1 and a finger 2 provided at its end. Wherein, the ins...

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Problems solved by technology

However, due to the limitation of the response speed of the driving motor, there is a long time difference between the time when the driving motor gives an over-current alarm and stops moving and the time when the actual manipulator collides, resulting in untimely collision protection and damage to the fingers of the manipulator.

[0008] Its four, before carrying out process, usually need operator to put unprocessed wafer into chamber, but because unprocessed wafer and processed wafer are difficult to discern with naked eyes, cause existence such as operator to process The hidden danger of wafers being thrown into the chamber

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