Multilayer high-pressure-resistant corrugated board for packaging material

A technology of packaging materials and corrugated cardboard, applied in the field of packaging materials, can solve the problems of low impact strength of corrugated cardboard, cardboard affecting internal objects, easy deformation, etc., and achieve the effect of facilitating handling, not easy to be scrapped, and high compression resistance

Inactive Publication Date: 2017-09-19
SUZHOU RUINAIJIE ELECTRONICS SCI & TECH NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the corrugated cardboard on the market is easily deformed when it is hit, resulting in low impact strength of the corrugated cardboard, and the deformation of the cardboard directly affects the internal objects, causing losses

Method used

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  • Multilayer high-pressure-resistant corrugated board for packaging material

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] Such as figure 1 As shown, embodiments of the present invention include:

[0017] A multi-layer high pressure-resistant corrugated cardboard for packaging materials, comprising a first corrugated board 1, a second corrugated board 2, a third corrugated board 3, a first rib 4 and a second rib 5, the first The reinforcing ribs 4 are evenly arranged between the first corrugated board 1 and the second corrugated board 2, and the second reinforcing ribs 5 are respectively evenly arranged between the second corruga...

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Abstract

The invention discloses a multi-layer high pressure-resistant corrugated cardboard for packaging materials, comprising a first corrugated board, a second corrugated board, a third corrugated board, a first reinforcing rib and a second reinforcing rib, the first reinforcing rib The ribs are evenly arranged between the first corrugated board and the second corrugated board, the second reinforcing ribs are evenly arranged between the second corrugated board and the third corrugated board, and the first reinforcing ribs and The second reinforcing ribs are arranged in a staggered position, the first reinforcing ribs have a trapezoidal structure, and the second reinforcing ribs have an inverted trapezoidal structure and a mirror image structure with the first reinforcing ribs. Through the above method, the multi-layer high pressure-resistant corrugated cardboard used in the packaging material of the present invention has relatively high compressive resistance and impact resistance to puncture, strengthens the overall strength of the corrugated cardboard, makes it difficult to deform, and is beneficial to the handling of goods , not easy to scrap.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to a multilayer high-pressure-resistant corrugated cardboard for packaging materials. Background technique [0002] At present, the commonly used paper packaging boxes are mostly made of ordinary corrugated cardboard, which is made of at least one layer of corrugated paper and one layer of cardboard paper, and has good elasticity and extensibility. It is mainly used in the manufacture of cartons, the sandwich of cartons and other packaging materials for fragile goods. [0003] At present, the corrugated cardboard on the market is easily deformed when it is hit, resulting in low impact strength of the corrugated cardboard, and the deformation of the cardboard directly affects the internal objects and causes losses. Contents of the invention [0004] The main technical problem to be solved by the present invention is to provide a multi-layer high pressure-resistant corr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/28B32B3/08B32B29/00
CPCB32B3/28B32B3/085B32B29/005B32B2307/50B32B2307/558B32B2439/00
Inventor 杨伟帅
Owner SUZHOU RUINAIJIE ELECTRONICS SCI & TECH NEW MATERIAL
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