Carrying plate assembly and mechanical arm with the carrying plate assembly

Abstract

The invention provides a bearing disc assembly and a mechanical arm comprising the same. The bearing disc assembly comprises a bearing disc and a plurality of gaskets, the bearing disc comprises a first end, a second end, and a bearing surface located between the two ends, the bearing surface forms a plurality of accommodating grooves, the upper side of each accommodating groove is narrow, the lower side of each accommodating groove is wide, the gaskets are respectively arranged in the accommodating grooves, each gasket includes an annular inclined surface and a top surface, the annular inclined surface is attached to a sidewall surface of the accommodating groove, and the top surface is aligned and connected with the bearing surface, The mechanical arm comprises the bearing disc assembly and an operation body. The gaskets can provide a wafer anti-sliding effect. The bearing surface forms a vent hole and a first through holes, and the gaskets form second through holes so that the pressure of the upper surface and the lower surface of a wafer can be balanced. The top surface of the gasket and the bearing surface are aligned, and the periphery of the top surface of each gasket is connected with the periphery of an opening of each accommodating groove so that the whole accommodating groove is filled with the gasket, and the gasket can be stably accommodated in the accommodating groove and is not easily and upwardly deformed and protrudes.

Description

technical field [0001] The invention relates to a carrier plate assembly and a mechanical arm with the carrier plate assembly, in particular to a carrier plate assembly and a mechanical arm for holding wafers. Background technique [0002] Wafer (Wafer) refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. The wafer can be used to manufacture integrated circuits, and the manufacturing process of integrated circuits requires a considerable number of steps. The direction of light, thin and small is developing. Therefore, today's fabs are using robotic arms instead of manpower to carry wafers, so as to improve efficiency and reduce errors and various derived problems caused by manpower operations. [0003] A general mechanical arm such as the "industrial mechanical arm" of Chinese Taiwan Patent No. TW I441719 includes a manipulator, a multi-joint manipulator and a body, and the two ends of the multi-joint manipulator are connected to t...

AI Technical Summary

Problems solved by technology

Although the above-mentioned mechanical arm is provided with the abutting member so that the wafer can be abutted against, when the wafer is transported, the wafer is still prone to slip due to vibration or other factors, causing the wafer to deviate from its original position

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