Two-dimensional high-density rectangular waveguide organized array design

A rectangular waveguide, high-density technology, applied in electrical components, antennas, etc., can solve the problems of back-end circuit modules that are not easy to integrate front-end antenna arrays

Inactive Publication Date: 2017-09-19
杭州翼邦芯科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a two-dimensional high-density rectangular waveguide array design, which aims to solve the problem that the traditional back-end circuit module is not easy to integrate with the front-end antenna array

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  • Two-dimensional high-density rectangular waveguide organized array design
  • Two-dimensional high-density rectangular waveguide organized array design
  • Two-dimensional high-density rectangular waveguide organized array design

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] As the first embodiment of the present invention, such as figure 1 As shown, a two-dimensional high-density rectangular waveguide array design provided by the present invention includes a rectangular waveguide E-plane stacked array 10 and a rectangular waveguide H-plane stacked array 20 .

[0028] The rectangular waveguide E-plane stacked array 10 is formed by mirroring 2M E-plane half-waveguide layers 101 in a direction perpendicular to the E-plane of the rectangular waveguide and stacking them sequentially, where M is a positive integer.

[0029] The rectangular waveguide H-plane stacked ...

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Abstract

The present invention belongs to the antenna technology field, especially to a two-dimensional high-density rectangular waveguide organized array design. The design comprises a rectangular waveguide E-surface lamination array and a rectangular waveguide H-surface lamination array, and the rectangular waveguide E-surface lamination array and the rectangular waveguide H-surface lamination array are equivalent to two grading arrays; and one surface of the rectangular waveguide E-surface lamination array is butt joint with one surface of the rectangular waveguide H-surface lamination array, namely the two grading arrays are subjected to cascading. According to the structures of the grading arrays and the two grading array cascading, the arbitrary transformation of the work wave transmission paths on two dimensions can be realized so as to allow the work wave transmission paths to smoothly transit from a front-end antenna array to a rear-end circuit module and solve the problem that the rear-end circuit module is not easy to integrate with the front-end antenna array.

Description

technical field [0001] The invention belongs to the technical field of antennas, in particular to a two-dimensional high-density rectangular waveguide array design. Background technique [0002] The phased array antenna is an antenna that changes the shape of the pattern by controlling the feeding phase of the radiating elements in the array antenna, and plays an important role in both military and civilian fields. The structure of the phased array antenna array requires the electrical performance of the radiation unit, array synthesis, video and antenna part (Transmitter and Receiver, T / R component) in the wireless transceiver system, power distribution network, beam control, DC power supply (DC power supply) and other electrical performance and Consider the structural layout. [0003] There are two traditional integrated array structures of phased array antennas: horizontally integrated vertical assembly based on tiled surface arrays and vertically integrated horizontally...

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01Q3/26
CPCH01Q3/2658
Inventor张健俞键
Owner杭州翼邦芯科技有限公司