Unlock instant, AI-driven research and patent intelligence for your innovation.

Comprehensive protection circuit, comprehensive protection device and plastic package device

A technology for comprehensive protection devices and protection circuits, which is applied in the direction of emergency protection circuit devices, circuit devices, emergency protection devices with automatic disconnection, etc., can solve the problems of damage induction speed and inconsistency of comprehensive processing capabilities, and achieve improved power density and reliability effect

Active Publication Date: 2017-09-22
SHANGHAI YIMIN CHENGFENG ELECTRONICS SCI & TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there are inconsistencies in the induction speed of various failures and damages generated by the device, and the comprehensive processing capability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Comprehensive protection circuit, comprehensive protection device and plastic package device
  • Comprehensive protection circuit, comprehensive protection device and plastic package device
  • Comprehensive protection circuit, comprehensive protection device and plastic package device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0064] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0065] Such as figure 1As shown, a comprehensive protection circuit is applied to IGBT power semiconductor devices, including input protection circuit 1, over-temperature protection circuit 2 and over-current short-circuit protection circuit 3;

[0066] The input end of the input protection circuit 1 is connected to the input control voltage 4 of the IGBT power semiconductor device, and the output end 12 of the input protection circuit 2 is connected to the input end of the over-temperature protection circuit 2;

[0067] The output terminal 17 of the over-temperature protection circuit 2 is connected to the input terminal of the over-current short-circuit protection circuit 3;

[0068] The output terminal of the overcurrent short circuit protection circuit 3 is connected to the input terminal 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a comprehensive protection circuit, a comprehensive protection device and a plastic package device. The comprehensive protection circuit comprises an input protection circuit, an over-temperature protection circuit and an overcurrent short-circuit protection circuit, wherein an input end of the input protection circuit is connected with an input control voltage of an insulated gate bipolar transistor (IGBT) power semiconductor device, an output end of the input protection circuit is connected with an input end of the over-temperature protection circuit, an output end of the over-temperature protection circuit is connected with an input end of the overcurrent short-circuit protection circuit, and an output end of the overcurrent short-circuit protection circuit is connected with an input end of the IGBT power semiconductor device. The comprehensive circuit disclosed by the technical scheme has the following advantages or beneficial effects that a peripheral circuit is not dependent, comprehensive and accurate protection is directly completed from a device packaged by an IGBT chip, and the power density and the reliability of the IGBT power semiconductor device are improved.

Description

technical field [0001] The invention relates to the field of IGBT power semiconductor devices, in particular to a comprehensive protection circuit, a comprehensive protection device and a plastic packaging device. Background technique [0002] At present, the main forms of failure and damage of IGBT power semiconductor devices are over-temperature, over-current and short-circuit. The over-temperature damage of IGBT power semiconductor devices is caused by the thermal fatigue of the devices. The reasons include improper heat dissipation design, unreasonable drive circuit design, and changes in external loads. The causes of overcurrent and short-circuit damage to IGBT power semiconductor devices are poor load insulation, bridge short-circuit caused by external debris, and turn-off peak voltage of inductive loads. The above failure and damage forms have included more than 95% of the failure and damage range of IGBT power semiconductor devices. [0003] Special attention shoul...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H02H7/20H02H3/08H02H5/04
CPCH02H3/08H02H5/04H02H7/20
Inventor 杨友林陈勤华
Owner SHANGHAI YIMIN CHENGFENG ELECTRONICS SCI & TECH CO LTD