Method for manufacturing deposition mask, and deposition mask
A technology of evaporation mask and manufacturing method, which is applied in vacuum evaporation coating, semiconductor/solid-state device manufacturing, sputtering coating, etc., and can solve the problems that it is not easy to accurately reproduce metal plates, etc.
Active Publication Date: 2017-09-26
DAI NIPPON PRINTING CO LTD
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Problems solved by technology
Therefore, it is not easy to accurately reproduce both the thickness of the metal plate, that is, the thickness of the vapor deposition mask and the shape of the through hole.
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[0064] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. It should be noted that in the drawings attached to this specification, for the convenience of illustration and easy understanding, the scale and the ratio of length and width have been changed and exaggerated appropriately from the actual scale and ratio of length and width. .
[0065] Figure 1~Figure 28 It is a figure for demonstrating an embodiment of this invention and its modification. In the following embodiments and their modification examples, the following method of manufacturing a vapor deposition mask is used as an example to describe the vapor deposition mask used to deposit organic materials on a substrate in a desired pattern when an organic EL display device is manufactured. Perform patterning. However, it is not limited to such applications, and the present invention can be applied to methods of manufacturing vapor deposition masks used in various applic...
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Abstract
The present invention addresses the problem of providing a method for manufacturing, using a plating treatment, a deposition mask in which a through-hole having a complicated shape is formed. This method for manufacturing a deposition mask includes: a first film-forming step for forming, on a substrate having insulating properties, a first metal layer that is provided with a first opening in a predetermined pattern; and a second film-forming step for forming, on the first metal layer, a second metal layer that is provided with a second opening connected to the first opening. The second film-forming step includes: a resist forming step for forming a resist pattern on the substrate and the first metal layer so as to leave a predetermined gap; and a plating treatment step for depositing the second metal layer on the first metal layer in the resist pattern gap. The resist forming step is carried out such that the first opening in the first metal layer is covered by the resist pattern, and such that the gap in the resist pattern is located on the first metal layer.
Description
【Technical Field】 [0001] The present invention relates to a method of manufacturing a vapor deposition mask in which two or more through holes are formed by a plating process. The invention also relates to an evaporation mask. 【Background technique】 [0002] In recent years, display devices used in portable devices such as smartphones and tablet computers require high-definition, for example, a pixel density of 400 ppi or higher. In addition, among portable devices, the demand for ultra-full HD is also increasing. In this case, the pixel density of the display device is required to be, for example, 800 ppi or more. [0003] Organic EL display devices have attracted attention due to their good responsiveness, low power consumption, and high contrast. As a pixel formation method of an organic EL display device, a method of forming pixels in a desired pattern using a vapor deposition mask including through holes arranged in a desired pattern is known. Specifically, first, the vapor...
Claims
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IPC IPC(8): C23C14/04C25D1/08H01L51/50H05B33/10
CPCC23C14/042C25D1/08H05B33/10C23C14/04C25D1/10C25D5/02C25D5/10H10K71/166
Inventor 池永知加雄
Owner DAI NIPPON PRINTING CO LTD