Manufacturing method of vapor deposition mask and vapor deposition mask
A technology of evaporation mask and manufacturing method, which is applied in vacuum evaporation coating, semiconductor/solid-state device manufacturing, sputtering coating and other directions, and can solve problems such as difficult and precise reproduction of metal plates.
Active Publication Date: 2019-10-25
DAI NIPPON PRINTING CO LTD
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Problems solved by technology
Therefore, it is not easy to accurately reproduce both the thickness of the metal plate, that is, the thickness of the vapor deposition mask and the shape of the through hole.
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[0064] One embodiment of the present invention will be described below with reference to the drawings. It should be noted that in the drawings attached to this specification, for the convenience of illustration and easy understanding, the scale and the size ratio of length and width are appropriately changed and exaggerated from the scale of the actual object and the size ratio of length and width. .
[0065] Figure 1 to Figure 28 It is a figure for demonstrating one embodiment of this invention and its modification. In the following embodiments and modifications thereof, a method for manufacturing a vapor deposition mask for depositing an organic material in a desired pattern on a substrate when manufacturing an organic EL display device will be described as an example. for patterning. However, it is not limited to such applications, and the present invention can be applied to methods of manufacturing vapor deposition masks used in various applications.
[0066] It shoul...
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Abstract
The present invention provides a method of manufacturing a vapor deposition mask in which through-holes having complex shapes are formed by a plating process. The vapor deposition mask manufacturing method of the present invention includes a first film-forming step of forming a first metal layer having first openings in a specific pattern on an insulating substrate, and forming a metal layer with a first opening on the first metal layer. A second film-forming step of the second metal layer in the second opening connected to the first opening. The second film forming step includes a resist forming step of forming a resist pattern on the substrate and the first metal layer with a specific gap therebetween, and forming the second metal layer on the first metal layer at the gap of the resist pattern. Plating treatment process for precipitation. The resist forming step is performed so that the first openings of the first metal layer are covered with the resist pattern and gaps in the resist pattern are located on the first metal layer.
Description
【Technical field】 [0001] The present invention relates to a method of manufacturing a vapor deposition mask in which two or more through holes are formed by a plating process. The invention also relates to evaporation masks. 【Background technique】 [0002] In recent years, display devices used in portable devices such as smartphones and tablet PCs have required high definition, for example, a pixel density of 400 ppi or higher. In addition, in portable devices, the demand for ultra-full high-definition is also increasing. In this case, the pixel density of the display device is required to be, for example, 800 ppi or more. [0003] Organic EL display devices are attracting attention because of good responsiveness, low power consumption, and high contrast. As a pixel forming method of an organic EL display device, there is known a method of forming pixels in a desired pattern using a vapor deposition mask including through holes arranged in a desired pattern. Specifically,...
Claims
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IPC IPC(8): C23C14/04C25D1/08H01L51/50H05B33/10
CPCC23C14/042C25D1/08H05B33/10C23C14/04C25D1/10C25D5/02C25D5/10H10K71/166
Inventor 池永知加雄
Owner DAI NIPPON PRINTING CO LTD