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Power module

一种功率模块、哑端子的技术，应用在功率模块的构造领域，能够解决耐压劣化等问题，达到提高绝缘耐压、制造成本的上升抑制的效果

Inactive Publication Date: 2017-09-26
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If there is an acute-angled part of the terminal, the electric field tends to concentrate on this part, so it may cause the breakdown voltage to deteriorate

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0024] figure 1 It is a plan view of the power module according to the embodiment of the present invention. The power module 1 includes a package 10 formed of molded resin that encapsulates a semiconductor element (not shown), and connection terminals 11 and dummy terminals 12 protruding from side surfaces of the package 10 . The connection terminal 11 is a terminal for external connection. The dummy terminal 12 is a terminal that is not used in actual use, and is used, for example, as a “flying lead” in an assembly process. The dummy terminal 12 is not assumed to be a terminal connected to the outside, and thus is shorter than the connection terminal 11 (the amount of protrusion from the package 10 is smaller than that of the connection terminal 11 ).

[0025] figure 2 It is a diagram showing the structure of the dummy terminal 12 of the power module 1 according to Embodiment 1, and is an enlarged side view of a portion of the power module 1 where the dummy terminal 12 is...

Embodiment approach 2

[0032] Figure 4 It is a diagram showing the structure of the dummy terminal 12 of the power module 1 according to Embodiment 2, and is an enlarged side view of a portion of the power module 1 where the dummy terminal 12 is provided.

[0033] Such as Figure 4 As shown, in Embodiment 2, the dummy terminal 12 is processed so as to bend upward (direction away from the plane P including the heat dissipation surface 10 a ) on the way. As a result, the distance between the plane P including the heat dissipation surface 10 a of the package 10 and the dummy terminal 12 becomes longer the closer to the tip of the dummy terminal 12 . Accordingly, in a state where the heat radiation fins are attached to the heat radiation surface 10a, the tip of the dummy terminal 12 is farther from the heat radiation fins than other parts. Therefore, similarly to Embodiment 1, the effect of improving the insulation withstand voltage between the dummy terminal 12 and the heat radiation fin is obtained...

Embodiment approach 3

[0036] Figure 6 It is a diagram showing the structure of the dummy terminal 12 of the power module 1 according to Embodiment 3, and is an enlarged side view of a portion of the power module 1 where the dummy terminal 12 is provided.

[0037] Such as Figure 6 As shown, similar to Embodiment 2, the dummy terminal 12 is processed so as to bend upward (direction away from the plane P including the heat dissipation surface 10 a ) on the way. In addition, in Embodiment 3, the bent portion of the dummy terminal 12 is bent in a curved shape. Accordingly, compared with the case of the second embodiment, the number of corners of the dummy terminal 12 is reduced, and electric field concentration is further suppressed. Therefore, compared with the second embodiment, the effect of further improving the dielectric breakdown voltage between the dummy terminal 12 and the heat radiation fin can be expected.

[0038] In addition, regarding the method of bending the dummy terminal 12 into a...

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PUM

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Abstract

A power module (1) comprises: a connection terminal (11) for external connection which protrudes from a side surface of a package (10); and a dummy terminal (12) which protrudes from the side surface of the package (10) and which is shorter than the connection terminal (11). The dummy terminal (12) is processed so as to have an incline on a bottom surface thereof. More specifically, the distance between a plane (P) including a heat radiation surface (10a) of the package (10) and the dummy terminal (12) increases toward the distal end of the dummy terminal (12). Therefore, in a state in which a heat radiating fin is attached to the heat radiation surface (10a), the distal end of the dummy terminal (12) is farther from the heat radiating fin than other portions.

Description

technical field [0001] The present invention relates to the structure of a power module, and in particular to the structure of a dummy terminal provided in the power module. Background technique [0002] In semiconductor devices (power modules) for electric power, for the purpose of optimizing the internal structure and simplifying the wiring on the substrate, there are cases where the ground pin (GND pin) connected to the control circuit and the power pin are separated. dummy terminal formed by shortening. The dummy terminal is used as a "flying lead" in the power module assembly process to ensure stability in manufacturing. [0003] When a power module is actually used, a high voltage is applied, so the temperature rises greatly, and in many cases, it is necessary to install fins for cooling. Usually, the heat dissipation fins of the power module are often used while being connected to the ground potential. Therefore, a high insulation withstand voltage is required betw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/50H01L23/36H01L25/07H01L25/18
CPCH01L23/36H01L23/49555H01L23/60H01L23/50H01L25/18H01L23/3672H01L25/072
Inventor 柴田祥吾长谷川真纪
Owner MITSUBISHI ELECTRIC CORP
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