101results about How to "Improve insulation withstand voltage performance" patented technology

The invention relates to a nanosecond continuous pulse ageing device and method of a vacuum interrupter. The nanosecond continuous pulse ageing device comprises a control system, a direct-current power supply, an energy storage unit, a forming network, a triggering unit and a control switch part, wherein the control system is connected to the direct-current power supply and the triggering unit; the output end of the direct-current power supply is connected with the energy storage unit and the triggering unit is connected with the control switch; the energy storage unit is connected with the forming network and the forming network is used for outputting a pulse voltage to the vacuum interrupter through a current limiting unit; the control unit is connected with the energy storage unit and the lower part of the vacuum interrupter is provided with an adjusting device. According to the method provided by the invention, by adjusting the energy of one time of the discharging process and controlling discharging times in the unit time, the ageing degree and the ageing tendency are controlled and the ageing uniformity of the vacuum interrupter is improved. In the invention, a nanosecond-grade continuous pulse source is taken as an ageing power supply of the vacuum interrupter. The best ageing effect of the vacuum interrupter can be achieved by controlling the discharging energy of single pulse, the repetition frequency and the action time of the continuous pulse.

The invention discloses an insulation technology of an aluminum back plate in a photovoltaic module. The insulation technology comprises the following steps: cutting the aluminum back plate, so that the size of the aluminum back plate is 4-5mm less than the size of glass; opening a square opening at an electrode lead part of the aluminum back plate; carrying out insulation treatment on the square opening through cushioning insulation small materials or by adopting a method to cover an edge to the square opening when the modules are arranged and laid; laminating and cutting the edge of a laminated piece; covering an edge to the laminated piece, the edge of which is cut by adopting a 0.5-1mm insulated rubber tape; spraying silica gel on the laminated piece to be framed up; and arranging a connecting box on the laminated piece. The insulation method of the aluminum back plate in the photovoltaic module is convenient to operate, low in investment and wide in application prospect.

PROBLEM TO BE SOLVED: To provide a small-sized high voltage circuit breaker with large capacity, of which rated current is increased in coping with recent requirement of a power system, which can have large capacity and capable of being used in high voltage.SOLUTION: First, a third switching part 3 is opened, and a current to be broken is made to flow through a serial connection part of a first switching part 1 and a second switching part 2. Next, the current is broken by separating electrodes of a vacuum breaking part constituting the first switching part 1 from each other with a prescribed distance, and it is made to withstand transient oscillatory voltage impressed between the electrodes. Afterwards, for example, after a maximum arc period after the distance between the electrodes of the first switching part 1 gets into a prescribed distance, the second switching part 2 is opened, and made to withstand the more severe impulse voltage.

The invention relates to a photoelectric element, especially to an optical coupler, which is also known as a photoisolator or an optoelectronic coupler or is called an optocoupler for short. According to the invention, a lead frame of an optical coupler falls into an infrared end lead frame and a photosensitive end lead frame; planes of glass sliding areas of the infrared end lead frame and the photosensitive end lead frame are perpendicular to a plane of the lead frame; infrared light emitting elements are installed on the infrared end lead frame and photosensitive elements are installed on the photosensitive end lead frame; the infrared end lead frame and the photosensitive end lead frame are fixed on a same plane and there is an enough insulation distance between the infrared end lead frame and the photosensitive end lead frame; the photosensitive elements directly face the infrared light emitting elements; outer surfaces of the glass sliding areas of the infrared end lead frame and the photosensitive end lead frame are cladded with transparent colloids, which are in ellipse shapes; and the infrared end lead frame, the photosensitive end lead frame and the transparent colloids are wrapped with a packaging shell tube. According to the invention, the optical coupler not only has good insulation and pressure resistant performances that a reflective optocoupler has, but also has a high photoelectric conversion efficiency that a direct-injection optocoupler has; besides, a CTR value is convenient for control.

The invention discloses a current measurement device and current measurement method based on a current divider. The current measurement device comprises a signal conversion module and a controller unit connected with the signal conversion module, wherein the signal conversion module includes a current divider voltage acquisition circuit and a temperature sensor; the current divider voltage acquisition circuit is connected with the current divider, the current divider voltage acquisition circuit is suitable for acquiring a sampling current signal passing through the current divider, convertingthe acquired sampling current signal into a sampling voltage signal and outputting the sampling voltage signal to the controller unit; the temperature sensor is suitable for being set on the current divider and outputting a sampling signal acquired by the temperature sensor to the controller unit; and the controller unit is suitable for generating an actually measured current value of the currentdivider according to the feedback sampling current signal and sampling signal. The current measurement device not only has an advantage of digital acquisition and can improve the anti-interference ability thereof, but also can timely correct the output data in allusion to the temperature change, thereby reducing the measurement error, and improving the measurement accuracy.

It is an object of the present invention to provide an integrated circuit device structured to uniformly apply a voltage to side oxide films formed in a trench at both sides in an SOI substrate.

The invention relates to a 75kV low-impedance coaxial cable used for connecting and wiring an accelerator control system and a linear pulse transformer for transmitting leading edge pulse signals. Braid multiple strands of tough copper wires outside the filler core as the inner conductor of the cable, and the inner conductor is provided with an isolation layer, a first layer of insulation, a second layer of insulation, a third layer of insulation, an isolation layer, an outer conductor and a sheath. The feature is: braiding multiple strands of tough copper wire on the filling core as the inner conductor of the cable, which not only reduces the weight of the cable, but also makes the whole cable soft and easy to bend. The isolation layer is a semi-conductive material to reduce the gap between the inner and outer conductors and the insulating layer, prevent the problem of partial discharge caused by the concentration of the electric field, and improve the withstand voltage of the cable. The first, second and third layers of insulation are respectively made of cross-linked polyethylene, polytetrafluoroethylene, and cross-linked polyethylene materials. The three layers of insulation together form a hierarchical composite insulation structure, which not only ensures the cable impedance, capacitance, inductance and the system. Matching design achieves low impedance of the cable.

The invention discloses a coil component and a manufacturing method thereof. The coil component includes: a plurality of coated conductive wires (S1, S4) forming a first winding layer wound around a winding core portion and a second winding layer wound around the winding core portion; and a resin coating layer (20) covering the coated conductive wires (S1, S4). A maximum space (W1) between the coated conductive wires (S1, S4) in the first winding layer is narrower than a diameter (as shown in the description) of the coated conductive wires. Therefore, the coil component can ensure higher isolation voltage.

The invention discloses a composite insulating material and a processing method thereof. The composite insulating material has a double-layer structure formed by a surface layer of epoxy glass-cloth and an inner layer of NOMEX insulated paper which are stuck together. The processing method comprises the following steps that: the moisture-eliminated NOMEX insulated paper with the necessary size and an epoxy prepreg are lapped between a steel plate with release paper, the steel plate is heated and pressurized to ensure that the epoxy prepreg is solidified into the epoxy glass-cloth with the functions of moisture protection and protection, the NOMEX insulated paper and the epoxy glass-cloth are stuck to form the needful composite insulating material. The composite insulating material has the advantages of both the NOMEX insulated paper and the epoxy glass-cloth, that is not only has good insulating performance of the NOMEX insulated paper but also has washable property of the glass-cloth and has the characteristics of good moisture protection and certain bending performance, thereby further improving the insulating and pressure-proof performance of the product.

An object of the present invention is to achieve downsizing, weight reduction, high withstand voltage, and cost reduction of winding devices such as transformers, reactors, and coils. The winding device of the present invention has a first bobbin (31), a second bobbin (32) and an E-shaped core (11, 12), the first bobbin (31) has a cavity (31d) and the high voltage The coil (21) is wound on the outside; the second bobbin (32) is assembled in a manner surrounding the first bobbin (31) and the low voltage coil (22) is wound on the outside; the E-shaped core (11, 12) Installed in the cavity (31d) of the first bobbin (31) and the outside of the second bobbin (32) to form a closed magnetic circuit, the second bobbin (32) has a housing (33) and A cover (34), the housing (33) has a bottom wall (33f) and a pair of side walls (33a) extending vertically upward from both sides of the bottom wall (33f); the cover (34) has a top wall (34e) And a pair of side walls (34a) protruding from both sides of the top wall (34e) vertically downward, the first bobbin (31) is arranged on a pair of side walls (34a) of the cover (34), the shell In the space of the second bobbin (32) formed by the bottom wall (33f) of the body (33) and the top wall (34e) of the cover (34).

The invention discloses a preparation method of metal soft magnetic compound materials, a chip component and a manufacturing method of the chip component. The preparation method of the metal soft magnetic compound materials includes the following steps that wet process mixing is carried out on metal magnetic powder and insulation wrapping materials to obtain slurry; the slurry is dried and screened to obtain powdery materials with preset granularity; the powdery materials are processed through a pyrolytic process at the air atmosphere to obtain the metal soft magnetic compound materials; the metal magnetic powder is silicon based ferroelectric magnetic powder or nickel based ferroelectric magnetic powder, and the insulation wrapping materials are MnO2, Mn(NO3)2 or MnCO3. Additives and the metal magnetic materials are mixed evenly, a chemical reaction is generated through the thermal treatment, a nanometer level wrapping layer is formed on the surface of the metal magnetic material particles, and therefore the metal soft magnetic compound materials high in insulation performance, resistant to voltage, high in heat stability and good in magnetic performance are obtained.

The invention relates to a high-voltage withstand and high-current coaxial connector, and is suitable for the butting of coaxial single-core shielding cables under the conditions of high voltage and high current, which is mainly applied to test the opening and closing properties of novel high-power quick power semiconductor devices and is also used for connecting coaxial high-voltage cables of high-frequency, high-voltage and high-current equipment of quick power semiconductors, such as IGBT (insulated gate bipolar transistor) and MOS (metal oxide semiconductor). The butting of a wire spring pin and a matched connecting head inner conductive shaft is used as the high-current mutual-plugging connection, so a center conductive body has the capability of conducting high current. The design of a multi-layer polytetrafluoroethylene insulting sleeve pipe overlapping structure is adopted, so the connector center conductive body combination and a connector outer annular conductive body have higher insulation and voltage withstand capabilities. The connector has the advantages that the integral structure is compact, the fixing is convenient, and the connection is convenient and quick; and a 1500A and 10ms-width direct current single current pulse can pass through the connector, and the capability of isolating 12kV direct current voltage is realized.

The invention relates to an epoxy resin pouring shielding cylinder of a transformer, belonging to the technical field of dry type transformers. The epoxy resin pouring shielding cylinder of the transformer is characterized by adopting a structure in the shape of a pouring shielding cylinder; and grounded shields inside the shielding cylinder are a plurality of open type metal straps in winding structures. The invention has the advantages of simple structure, reliable property, high insulating withstand voltage, reduced eddy-current loss, good heat-radiating effect, convenience in operation and assembly, manufacturing cost saving, reliable grounded shielding, safety operation of the transformer, and the like.

This invention belongs to high voltage transmission device and relates to indoor isolator switch, which comprises one insulator shell with round chamber, wherein, the insulation shell center is set with one main axis fixed with three-phase dynamic knife with boundary as axis for top and down arms; the insulation shell inner wqall top and down parts and side wall are imbedded with upper and down probes and earth probe; the upper probe is connected to wire in end within insulation materials; the down probe is covered on insulating materials down conductor to wire out end.

The invention discloses a non-alveolar splicing stator of a servo motor. The non-alveolar splicing stator comprises a stator main body, coils and a printed circuit board (PCB), wherein the stator main body is formed by splicing a plurality of T-shaped stator groups, and the coils are respectively wound around the stator groups. The invention also discloses an assembly process of the non-alveolar splicing stator. The stator main body is formed by splicing the plurality of stator groups, the stator is not needed to be provided with alveolars, no distance is generated between pole numbers, the material utilization rate is effectively improved, the production cost is reduced, the motor torque is also increased, and the motor efficiency is improved; during assembly, wires can be directly wound around the stator groups in an external winding way, and the winding efficiency is improved; and during the assembly process, three processes of wire insertion, wire binding and shaping are omitted, the damage to an enameled wire is reduced, and the production efficiency is improved.

The invention discloses an interconnected commutated board card integration and heat dissipation integrated control box. The control box is characterized in that a circuit board is arranged in a box body which is provided with a liquid cooling flow channel and a liquid cooling fin, and is encapsulated by a cold guiding cover plate to form an integrated control box; the liquid cooling fin is arranged in the liquid cooling flow channel which is provided with a liquid inlet and a liquid outlet; and the liquid cooling flow channel is arranged on the outside bottom of the box body and is encapsulated by a liquid cooling cover plate. Compared with the prior art, the control box has the advantages of being simple in structure, small in volume, good in airtightness, high in insulation and voltage resistance value and wide in application range, can be directly butted with a flexible needle to satisfy the requirements for the quick release of the flexible needle and the weldability of a shell, is capable of skillfully solving the assembling problem of the circuit board and effectively solving the double-side heat dissipation problem of the circuit board, has a characteristic of blind plugging, and is an interconnected commutated board card which integrates the modularization, efficient integration and heat dissipation.

The invention provides a uniaxial acceleration sensor device, which is used for solving the problems of high design requirements, poor shielding effect and poor detection precision of an accelerationsensor device used for detecting the acceleration signals of a high-speed train bogie in the prior art. The uniaxial acceleration sensor device comprises an acceleration sensor, a signal cable and a connector, wherein the signal cable is electrically connected with the acceleration sensor and the connector; the acceleration sensor comprises a printed board assembly, an inner layer insulation case,a shielding cover, an outer layer insulation case and a casing in sequential arrangement from inside to outside; a clamp groove is formed in the inner layer of the inner layer insulation case; the printed board assembly is arranged in the clamp groove and is respectively and fixedly connected with the shielding cover and the signal cable; and the signal cable sequentially passes through a tail pipe of the inner layer insulation case, a through hole of the shielding case, a tail pipe of the outer layer insulation case and a tail pipe of the case to be electrically connected with the connector.The uniaxial acceleration sensor device has the advantages that the precision of the installation position of a circuit board is high; and high reliability, high insulation voltage withstanding gradeand high protection grade are realized.

The invention provides a triaxial acceleration sensor device, which is used for solving the problems of high design requirement, poor shielding effect and low detection precision of an acceleration sensor device for detecting an acceleration signal of a bogie of a motor train unit in the prior art. The device comprises an acceleration sensor, a signal cable and a connector. The signal cable is electrically connected with the acceleration sensor and the connector. The acceleration sensor comprises a printed board assembly, an inner-layer insulating shell, a shielding cover, an outer-layer insulating shell and a shell which are sequentially arranged from inside to outside. The printed board assembly is provided with an acceleration induction circuit. The printed board assembly is fixedly connected with the signal cable. The signal cable sequentially penetrates the tail pipe of the inner-layer insulating shell, a through hole of the shielding cover, the tail pipe of the outer-layer insulating shell and the tail pipe of the shell to be electrically connected with the connector. The printed board assembly of the triaxial acceleration sensor is high in installation position precision, and the triaxial acceleration sensor has high reliability, insulation voltage-withstanding grade and protection grade.

The invention relates to a cleaning agent capable of electrified cleaning of electrical equipment with withstand voltage of 25KV or above, as well as a preparation method and application of the cleaning agent. The cleaning agent is composed of isomeric decane, perfluoropolyether oil, limonene and diethylene glycol butyl ether. The cleaning agent disclosed by the invention can be obtained by uniformly stirring and mixing the substances at room temperature. Compared with alcohol and carbon tetrachloride, the cleaning agent is very safe to the environment or human bodies, not only solves the problem that alcohol is flammable and combustible, but also overcomes the defect that carbon tetrachloride is toxic, can clean electrical equipment, and can achieve cleaning an electrified mode, the highest withstand voltage is 25 KV or above, and therefore the working efficiency of production type enterprises can be greatly improved.

The invention relates to a high-voltage direct current power supply applied to a dust removal system. The high-voltage direct current power supply comprises a converter and a high-voltage multiplier, wherein the converter comprises a three-phase input filter, a rectifier circuit and a high-voltage power supply inverter circuit, which are sequentially connected with one another; a zero current soft switch IGBT full-bridge circuit is adopted by the high-voltage power supply inverter circuit; an output end of the high-voltage power supply inverter circuit is connected with a first resonant capacitor C2 in series; the high-voltage multiplier comprises a high-voltage transformer, a voltage-doubler rectifier, a sparking-resistant circuit and a high-voltage output structure, which are sequentially connected with one another; a primary side of the high-voltage transformer is connected with an resonant inductor L1 in series; the primary side of the high-voltage transformer is connected with a second resonant capacitor C1 in parallel; and the first resonant capacitor C2, the resonant inductor L1 and the second resonant capacitor C1 form a resonant tank circuit. Combination of the high-voltage power supply inverter circuit and the resonant tank circuit disclosed by the invention has short-circuit self-protecting characteristics, namely the resonant inductor can block a current jump when a load is in a short circuit, so that the impact to the power supply circuit is effectively reduced; and the sparking resistance of the circuit is improved.

The invention relates to a heat dissipation structure suitable for a spacecraft high-power device. The structure comprises an installation pressing block, an elastic sponge body, heat conduction filler, an insulation ceramic piece, an insulation sleeve and an installation plate. The installation plate and the installation pressing block are main heat dissipation structures, a single-lug high-powerdevice is fixed to the installation plate, the insulation ceramic piece is arranged between the installation plate and the device, and the heat conduction filler is evenly smeared at the gap betweenthe installation plate and the device; a fastener and a metal shell of the single-lug high-power device are isolated by using a T-shaped insulating sleeve; and the elastic sponge body is loaded between the installation pressing block and the device to provide uniform pressing force for the mounting surface of the device. According to the structure, a large-area heat conduction path does not need to be drawn, active thermal control measures do not need to be provided, the temperature rise suppression amplitude of the single-lug high-power device can reach 23% or above, the insulation and voltage resistance of 10 kV or above can be achieved, and the structure can be widely applied to insulation and heat dissipation installation of the spacecraft high-power device.

A signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the first coil and the second coil face one another; a second insulation film surrounding the first coil and comprising a second dielectric body that has a resistivity lower than the first dielectric body; and a third insulation film surrounding the second coil and comprising a third dielectric body that has a resistivity lower than the first dielectric body. Or, the signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the first coil and the second coil face one another; a second insulation film surrounding the first coil and comprising a second dielectric body that has a dielectric constant higher than the first dielectric body; and a third insulation film surrounding the second coil and comprising a third dielectric body that has a dielectric constant higher than the first dielectric body.

The invention relates to a resin frame, a preparation method, and an application thereof and belongs to the field of photovoltaic materials. The resin frame is composed of, by weight, 80 parts of ABS resin, 10-50 parts of PA6, 20-50 parts of long-glass fibers, 3-20 parts of a compatilizer, 0.3-1.5 parts of an anti-oxidizing agent, 0.5-1.4 parts of an ultraviolet absorber, 0.3-1.3 parts of an impregnating agent, 0.01-0.6 parts of a photo-stabilizer, and 0.5-6 parts of a flame retarder. The ABS / PA6 resin material modified by the glass fibers and the additives is light in weight, has good insulation property and strong flame retarding performance, has strong anti-salt smoke corrosion capability, and can be used as a novel material in a frame of a solar component.

The invention relates to a protector, which is used in a motor protection and control system to detect the real-time temperature of the motor, and quickly cut off the circuit when the detected temperature exceeds the set value, so as to realize the stall protection of the motor; the protector shell is a whole The sealed welding structure can meet the quality requirements of the vacuum impregnation process for motor enameled wire windings; the bimetal structure is used to achieve temperature protection from a low temperature of 80 degrees to a high temperature of 180 degrees; the insulator is made of high temperature resistant glass fiber material or high temperature resistant ceramic material to achieve High temperature insulation; the protector also includes a built-in auxiliary action structure to realize rapid cutoff between the moving contact and the static contact. The protector of the present invention has high-current tolerance characteristics and high-temperature insulation characteristics. It adopts a fully-sealed structure, can adapt to the working conditions of vacuum varnish immersion, and can realize rapid cut-off. It can be used in motor protection and control systems, and has excellent motor blocking. turn protection feature.

The invention provides a piezoelectric acceleration sensor, which comprises an outer assembly, an inner assembly and an insulating hood. A containing cavity is formed in the outer assembly; the innerassembly is arranged in the containing cavity and comprises a shielding hood and a sensor core arranged in the shielding hood; and the insulating hood is arranged in the containing cavity and attachedto the peripheral wall of the shielding hood. The piezoelectric acceleration sensor provided by the invention has good pressure resistance and insulation, and is not prone to breakdown when encountering lightning or abnormal high-voltage input.

The invention provides an elastic packaging structure for a semiconductor chip. The elastic packaging structure comprises an upper electrode, a lower electrode, an annular packaging structure and a plurality of chip subunits, wherein the plurality of chip subunits are arranged between the upper electrode and the lower electrode; the annular packaging structure is arranged on the side edges of theupper electrode and the lower electrode in a sealed mode and forms a closed tube shell structure with the upper electrode and the lower electrode. According to the invention, the packaging cost can beeffectively reduced, the environmental adaptability of the semiconductor chip is improved, the service life of the semiconductor chip is prolonged, the universality is high, the packaging cost of semiconductor chip failure can be reduced to the greatest extent, and the packaging yield of the semiconductor chip is remarkably improved. The tube shell structure is a sealed structure, so the adaptability of the semiconductor chip to the application environment can be greatly improved; the tube shell structure is filled with the silica gel, so the insulation and voltage resistance of the semiconductor chip can be greatly improved, the voltage class of the semiconductor chip is higher, and the reliability of the semiconductor chip is higher.

A semiconductor device that is provided with: a drain region (1) that is configured from a first or second conductive-type semiconductor; a drift layer (2) that is configured from the first conductive-type semiconductor; a base region (4) that is configured from the second conductive-type semiconductor; a source region (5) that is configured from a high concentration of the first conductive-type semiconductor; a contact region (6) that is configured from a high concentration of the second conductive-type semiconductor; a trench-gate structure that includes an upper-stage-side gate structure and a lower-stage-side gate structure; a source electrode (10) that is connected to the source region and the contact region; and a drain electrode (12) that is arranged on an undersurface side of the drain region. The upper-stage-side gate structure is arranged inside a trench (7) on an upper-stage side and has a first gate insulating film (8a) and a first gate electrode (9a). The lower-stage-side gate structure is arranged inside the trench (7) on a lower-stage side and has a second gate insulating film (8b), which is configured from an insulating material that has a high dielectric constant, and a second gate electrode (9b).

The invention discloses a heating body and a manufacturing process thereof. The heating body comprises a heating body green body and a heating coating for heating, wherein the heating coating coats the outer surface of the heating body green body; the heating body green body is provided with a water inlet and a water outlet; a plurality of partition plates are arranged in the heating body green body, each partition plate is provided with flow channel through holes which are communicated with one another, the partition plates divide the heating body green body into a plurality of sections, andwater can be rapidly and fully heated after entering the heating body green body. The heating body is manufactured into sub-component green bodies through a mold and then injected into the sub-component green bodies through an injection molding machine, the sub-component green bodies are combined to form a heating body heat exchange green body, degreasing sintering is conducted, a heating body metal green body is obtained, then an insulating layer is sprayed or printed on the surface, and a conductive electrode is bonded or printed on the surface of the insulating layer. A thick film or graphene mixed heating material is sprayed, and finally an insulating layer is printed or sprayed on the surface. The heating body is integrally formed, and is simple in structure, small in size and high inheat efficiency.

The invention relates to an environment-friendly and efficient special electric appliance composite cleaning agent. The composite cleaning agent comprises an electric appliance surface cleaning agentand a circuit board cleaning agent. The electric appliance surface cleaning agent is composed of isomeric decane, perfluoropolyether oil, limonene and diethylene glycol butyl ether. The circuit boardcleaning agent includes decane, undecane, absolute ethyl alcohol and isododecane. The undecane and the isomeric decane in the electric appliance surface cleaning agent and the circuit board cleaning agent are used as main agents, which are similar in structure, and the electric appliance surface cleaning agent and the circuit board cleaning agent have the characteristics of ultra-pure environment-friendly safe solvent, no toxicity, no harm and no odor. The electric appliance surface cleaning agent and the circuit board cleaning agent adopt environment-friendly solvents, do not contain benzene,halogenated hydrocarbon or ODS substances, and are more environmentally friendly and efficient.