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A kind of active brazing filler metal and its preparation method, the method for using active brazing filler metal to braze sapphire and oxygen-free copper

A technology of active solder and oxygen-free copper, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as easy cracking, low strength, and residual internal stress, so as to alleviate cracks, increase shear strength, and improve The effect of strength and airtightness

Active Publication Date: 2019-11-12
MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a new type of active solder and its preparation method, as well as the method of utilizing active solder to braze sapphire and oxygen-free copper. There is residual internal stress in the brazing between sapphire and oxygen-free copper, which affects the problem that the strength of the brazing connection between sapphire and oxygen-free copper is not high, and it is easy to crack or even break when subjected to external force

Method used

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  • A kind of active brazing filler metal and its preparation method, the method for using active brazing filler metal to braze sapphire and oxygen-free copper
  • A kind of active brazing filler metal and its preparation method, the method for using active brazing filler metal to braze sapphire and oxygen-free copper
  • A kind of active brazing filler metal and its preparation method, the method for using active brazing filler metal to braze sapphire and oxygen-free copper

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Effect test

Embodiment 1

[0053] A kind of active solder, its component comprises Ag powder, Cu powder, and binding agent, also includes Cu 4 Ti 3 powder and W nanoparticles; wherein the mass ratio of Ag powder and Cu powder is 1:0.22, and the Ag powder and Cu powder 4 Ti 3 The mass ratio of the powder is 1:0.07, the mass ratio of the Ag powder to W nanoparticles is 1:0.01, and the mass ratio of the Ag powder to the binder is 1:0.03.

Embodiment 2

[0055] A kind of active solder, its component comprises Ag powder, Cu powder, and binding agent, also includes Cu 4 Ti 3 powder and W nanoparticles; wherein the mass ratio of Ag powder and Cu powder is 1:0.46, and the Ag powder and Cu powder 4 Ti 3 The mass ratio of the powder is 1:0.24, the mass ratio of the Ag powder to W nanoparticles is 1:0.02, and the mass ratio of the Ag powder to the binder is 1:0.04.

Embodiment 3

[0057] A kind of active solder, its component comprises Ag powder, Cu powder, and binding agent, also includes Cu 4 Ti 3 powder and W nanoparticles; wherein the mass ratio of Ag powder and Cu powder is 1:0.22, and the Ag powder and Cu powder 4 Ti 3 The mass ratio of the powder is 1:0.24, the mass ratio of the Ag powder to W nanoparticles is 1:0.01, and the mass ratio of the Ag powder to the binder is 1:0.03.

[0058] In conjunction with embodiment 1-3 and appended figure 1 As shown, the question about the components:

[0059] Cu provided in this example 4 Ti 3 As the addition source of active element Ti, it can effectively prevent the active element Ti from being oxidized during the brazing heating process and lose its wetting effect on sapphire. At the same time, Cu 4 Ti 3 The addition of the Ag-Cu eutectic solder matrix will not introduce other impurity elements, which can effectively improve the strength and airtightness of the joint. It is worth noting that the inv...

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Abstract

The invention discloses an active brazing filler metal, a preparation method of the active brazing filler metal and a method for brazing sapphire and oxygen-free copper by utilizing the active brazing filler metal. The active brazing filler metal comprises Ag powder, Cu powder, an adhesion agent, Cu4Ti3 powder and W nano-particles. The mass ratio of the Ag powder to the Cu powder is 1:0.22-0.46. The mass ratio of the Ag powder to the Cu4Ti3 powder is 1:(0.07-0.24). The mass ratio of the Ag powder to the W nano-particles is 1:(0.01-0.02). The mass ratio of the Ag powder to the adhesion agent is 1:(0.03-0.04). According to the active brazing filler metal, the provided Cu4Ti3 is used as an adding source of an active element Ti, the fact that the active element Ti is oxidized in the brazing heating process and loses the wetting action for the sapphire is avoided effectively, meanwhile, because of the adding of the Cu4Ti3, other impurity elements cannot be introduced in a brazing filler metal matrix of Ag-Cu eutectic, and the strength and the gas impermeability of a joint can be improved effectively.

Description

technical field [0001] The invention relates to the field of brazing material and brazing, in particular to a novel active solder and its preparation method, as well as a method for brazing sapphire and oxygen-free copper by using the active solder. Background technique [0002] As a single crystal of α-Al2O3, sapphire has very good optical properties, the birefringence in the direction of the triple symmetry axis is 0, the dielectric constant and dielectric loss are small, and it has good performance in multiple bands such as infrared, visible light and microwave. At the same time, sapphire also has many advantages such as high strength, high hardness (Mohs hardness is 9, second only to diamond), corrosion resistance, high temperature resistance, wear resistance, etc. At present, sapphire window materials are widely used in missile rectification Covers, satellites, fighter jets and other high-speed aircraft. In addition, as a microwave window, sapphire has small dielectric...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/3006B23K35/40
Inventor 刘静杨瑞龙饶咏初蒋春丽罗丽珠
Owner MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS