A kind of active brazing filler metal and its preparation method, the method for using active brazing filler metal to braze sapphire and oxygen-free copper
A technology of active solder and oxygen-free copper, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as easy cracking, low strength, and residual internal stress, so as to alleviate cracks, increase shear strength, and improve The effect of strength and airtightness
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Embodiment 1
[0053] A kind of active solder, its component comprises Ag powder, Cu powder, and binding agent, also includes Cu 4 Ti 3 powder and W nanoparticles; wherein the mass ratio of Ag powder and Cu powder is 1:0.22, and the Ag powder and Cu powder 4 Ti 3 The mass ratio of the powder is 1:0.07, the mass ratio of the Ag powder to W nanoparticles is 1:0.01, and the mass ratio of the Ag powder to the binder is 1:0.03.
Embodiment 2
[0055] A kind of active solder, its component comprises Ag powder, Cu powder, and binding agent, also includes Cu 4 Ti 3 powder and W nanoparticles; wherein the mass ratio of Ag powder and Cu powder is 1:0.46, and the Ag powder and Cu powder 4 Ti 3 The mass ratio of the powder is 1:0.24, the mass ratio of the Ag powder to W nanoparticles is 1:0.02, and the mass ratio of the Ag powder to the binder is 1:0.04.
Embodiment 3
[0057] A kind of active solder, its component comprises Ag powder, Cu powder, and binding agent, also includes Cu 4 Ti 3 powder and W nanoparticles; wherein the mass ratio of Ag powder and Cu powder is 1:0.22, and the Ag powder and Cu powder 4 Ti 3 The mass ratio of the powder is 1:0.24, the mass ratio of the Ag powder to W nanoparticles is 1:0.01, and the mass ratio of the Ag powder to the binder is 1:0.03.
[0058] In conjunction with embodiment 1-3 and appended figure 1 As shown, the question about the components:
[0059] Cu provided in this example 4 Ti 3 As the addition source of active element Ti, it can effectively prevent the active element Ti from being oxidized during the brazing heating process and lose its wetting effect on sapphire. At the same time, Cu 4 Ti 3 The addition of the Ag-Cu eutectic solder matrix will not introduce other impurity elements, which can effectively improve the strength and airtightness of the joint. It is worth noting that the inv...
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