Hydrophone integrated module and manufacturing process thereof

An integrated module and manufacturing process technology, which is applied in the field of hydrophone integrated modules and its manufacturing process, can solve the problems that affect the portability and applicability of use, the size is difficult to make small, and the integration level is low. Reduced size and high reliability

Pending Publication Date: 2017-10-20
纽威仕微电子(无锡)有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, the hydrophone is usually a single device with a relatively single function, requiring many external components to work together, and the integration level is low, re

Method used

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  • Hydrophone integrated module and manufacturing process thereof
  • Hydrophone integrated module and manufacturing process thereof
  • Hydrophone integrated module and manufacturing process thereof

Examples

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Example Embodiment

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0026] see figure 1 , figure 2 , image 3 , A hydrophone integrated module of the present invention includes a substrate 1. The substrate 1 is provided with a hydrophone sensor 2, a pressure sensor 3, a communication module 4, and an ASIC chip 5. In the example of the present invention, the communication module is Bluetooth, hydrophone The sensor sensor 2, the pressure sensor 3, the communication module 4 and the ASIC chip 5 are respect...

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Abstract

The invention provides a hydrophone integrated module which is highly integrated, functionally rich, small and light, and can easily meet the requirements of a small installation environment. The hydrophone integrated module includes a substrate which is equipped with a hydrophone sensor, a pressure sensor, a communication module and an ASIC chip. The hydrophone sensor, the pressure sensor, the communication module and the ASIC chip are encapsulated in an injection molding layer. The hydrophone sensor has a sound inlet opening at the upper end. The pressure sensor has an induction opening communicated with the outside at the upper end. The hydrophone sensor is connected with the pressure sensor through a conductor and a conductive wire which is arranged in the substrate. The hydrophone sensor and the pressure sensor are connected with the conductive wire arranged in the substrate through conductors. The communication module and the ASIC chip are connected with the conductive wire through solder balls. The conductive wire is connected with bottom pads arranged on the lower surface of the substrate. The invention further provides a manufacturing process of the hydrophone integrated module.

Description

technical field [0001] The invention relates to the technical field of hydrophones, in particular to a hydrophone integrated module and a manufacturing process thereof. Background technique [0002] The hydrophone, also known as the underwater microphone, can convert the acoustic signal generated by the underwater pressure change into an electrical signal, so that the underwater pressure can be reliably obtained. It is often used for sound field mapping and acoustic sensor detection and calibration. And research in the field of acoustics, such as the detection, calibration and performance evaluation of ultrasonic equipment. With the continuous development and progress of science and technology, the application technology of hydrophones has gradually matured. [0003] In the prior art, the hydrophone is usually a single device with a relatively single function, requiring many external components to work together, and the integration level is low, resulting in a complex struc...

Claims

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Application Information

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IPC IPC(8): G01H11/08H01L25/07H01L25/16
CPCH01L25/072H01L25/16G01H11/08H01L2924/15192H01L2224/48091H01L2924/00014
Inventor 赵晓宏林挺宇俞学东罗九斌
Owner 纽威仕微电子(无锡)有限公司
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