Fingerprint recognition chip packaging method and structure

Abstract

The invention discloses a fingerprint recognition chip packaging method and structure. The method includes: attaching a fingerprint recognition chip to a first surface of a substrate; printing a wire on the first surface of the substrate; arranging a connecting wire between the first surface of the substrate and the fingerprint recognition chip; packaging the outer surfaces of the substrate and the fingerprint recognition chip by using packaging material, wherein a packaging layer covers the connecting wire and the fingerprint recognition chip; the packaging material comprises a demoulding material the concentration of which on the surface of the packaging layer is higher than that inside the packaging layer; and grinding the packaging layer. Since the concentration of the demoulding material in the packaging material on the surface of the packaging layer is higher than that inside the packaging layer, the concentration of the demoulding material in the packaging layer on the surface of the fingerprint recognition chip can be reduced after the packaging layer is grinded, thereby improving the recognition sensitivity of the packaged fingerprint recognition chip. Since the surface of the fingerprint recognition chip is protected by the packaging layer, the fingerprint recognition chip can be protected from being damaged.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a fingerprint recognition chip packaging method and packaging structure. Background technique [0002] Fingerprint identification chip refers to the chip product with embedded fingerprint identification technology, which can realize fingerprint image acquisition, feature extraction and feature comparison chip on chip, and develops the function of fingerprint identification that can be conveniently realized, which greatly reduces the threshold of fingerprint identification industry , has a very positive role in promoting the promotion of fingerprint identification. [0003] The fingerprint identification chip accurately and sensitively senses the fingerprint signal is the key point of the fingerprint identification chip packaging process. When packaging a non-fingerprint identification chip, the chip is often plastic-sealed with a plastic sealant, and the plastic ...

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Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a fingerprint identification chip packaging method and packaging structure to solve the problem that if the fingerprint identification chip is not packaged in the prior art, the fingerprint identification chip will easily be damaged, and the existing packaging process is used. The problem that will reduce the recognition sensitivity of the fingerprint recognition chip

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