Adaptable molded leadframe package and related method
A technology for molding leads and packages, used in electrical components, semiconductor devices, electrical solid devices, etc., can solve problems such as increasing manufacturing cost, time and complexity
Active Publication Date: 2017-10-31
INFINEON TECH AMERICAS CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
When switching from a dual-in-line package to a single-in-line package, semiconductor components and electrical wiring need to undergo a complete redesign, which requires reconfiguration of the entire package, thereby increasing manufacturing cost, time and complexity
[0004] Therefore, there is a need to overcome the deficiencies and deficiencies of the prior art by providing a highly adaptable leadframe package that enables an easier transition from a dual in-line package to a single in-line package
Method used
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[0031] The following description contains specific information about implementations in the present disclosure. The drawings in this application and their detailed description are intended to relate to exemplary embodiments only. Unless otherwise specified, similar or corresponding elements in the figures may be indicated by similar or corresponding reference symbols. Furthermore, the drawings and descriptions in the present application are generally not to scale and are not intended to correspond to actual relative dimensions.
[0032] refer to Figure 1A , Figure 1A A top plan view of a portion of a semiconductor package being processed according to an initial processing action is shown in accordance with one embodiment of the present application. For example, an initial processing action includes disposing at least one semiconductor device on a continuous conductive structure having a leadframe island coupled to a first lead and a second lead.
[0033] Such as Figure 1A...
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The disclosure relates to an adaptable mold leadframe package and related method. For example, a semiconductor package includes at least one semiconductor device situated on a leadframe island, a first at least one lead protruding from a first side of the semiconductor package and configured to provide a first electrical connection to at least one terminal of the at least one semiconductor device, a second at least one lead protruding from a second side of the semiconductor package and configured to provide a second electrical connection to the at least one terminal of the at least one semiconductor device, and a continuous conductive structure configured to provide a conductive path between the first at least one lead, the second at least one lead, and the at least one terminal of the at least one semiconductor device through the leadframe island such that the at least one semiconductor device continues to function after trimming the first at least one lead.
Description
technical field [0001] The present disclosure relates generally to the field of semiconductors, and more particularly to conformable molded leadframe packages and related methods. Background technique [0002] A leadframe assembly, typically having a leadframe and one or more semiconductor dies, can simplify circuit design, reduce cost and provide higher efficiency and improved performance by keeping related and dependent circuit components in close proximity. Additionally, leadframe assemblies can facilitate application integration and better electrical and thermal performance compared to using separate packages for the various circuit components. [0003] Conventional leadframe assemblies can be configured in a single in-line package (SIP) where all leads protrude from one side of the package, or a dual in-line package (DIP) where all leads protrude from both sides of the package. When switching from a dual in-line package to a single in-line package, the semiconductor co...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/495H01L23/31
CPCH01L23/3107H01L23/49524H01L23/49541H01L2924/181H01L2224/0603H01L2224/48091H01L2224/48137H01L23/49503H01L23/49568H01L23/49575H01L23/4952H01L2224/06181H01L2924/00014H01L2924/00012H01L23/3114H01L23/49562H01L29/1608H01L29/2003H01L29/7787
Inventor H·林大川胜己
Owner INFINEON TECH AMERICAS CORP