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Integrated type heat dissipation apparatus

A heat sink, integrated technology, used in cooling/ventilation/heating retrofits, electrical components, electrical equipment structural parts, etc.

Active Publication Date: 2017-10-31
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Abstract
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Problems solved by technology

[0006] Therefore, it is no longer sufficient to use a single heat pipe or vapor chamber for today's electronic components. Therefore, how to combine heat pipes and vapor chambers to achieve uniform temperature and remote heat conduction or heat dissipation at the same time, in order to greatly improve heat conduction. Efficiency, and effectively solving the heat dissipation problem of high-power electronic components is what the industry needs to improve

Method used

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  • Integrated type heat dissipation apparatus
  • Integrated type heat dissipation apparatus
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Embodiment Construction

[0116] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the embodiments of the accompanying drawings.

[0117] The present invention provides an integrated cooling device, please refer to Figure 1A , Figure 1B , figure 2 , is a three-dimensional decomposition and assembly diagram of the first embodiment of the present invention. As shown in the figure, the integrated heat dissipation device includes at least one first shell 11, one second shell 12, multiple third shells 13, multiple first heat pipes 14 and at least one second heat pipe 15, the first shell The body 11 in this embodiment means that a first shell 11 is located above the second shell 12, and the third shells 13 in this embodiment mean that two third shells 13 are located below the second shell 12 and Arranged in a left-right arrangement. The first housing 11 , the second housing 12 and the second housings 12 are preferably m...

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Abstract

The invention provides an integrated type heat dissipation apparatus. The integrated type heat dissipation apparatus comprises at least one first shell, a second shell and a plurality of third shells; the first shell and the second shell comprise a first shell cavity and a second shell cavity respectively; each third shell comprises a third shell cavity; each third shell is connected with the second shell through a first heat pipe; and the first shell runs through the second shell to be connected to the corresponding third shell through a second heat pipe, so that the working fluid in each third shell cavity enters the first and the second shell cavities through the respectively connected first and second heat pipes so as to perform vapor-liquid circulation heat dissipation.

Description

【Technical field】 [0001] The present invention relates to an integrated heat dissipation device, especially an integrated heat dissipation device applied to heat dissipation. 【Background technique】 [0002] As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Therefore, in order to effectively solve the heat dissipation problem of components in electronic equipment, the industry has proposed vapor chambers and heat pipes with better heat conduction performance to effectively solve the current heat dissipation problem. [0003] Vapor chamber is a rectangular shell (or plate body), the inner wall of the inner chamber of the shell is provided with a capillary structure, and the inside of the shell is filled with work...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 蓝文基
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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