A display panel and display device

A technology for display panels and display devices, which is applied in sub-office equipment, electric solid-state devices, semiconductor devices, etc., and can solve problems such as difficulty in thin-film packaging, troubles, and difficulty in thin-film packaging design

Active Publication Date: 2021-05-14
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since laser drilling is a complicated process, it is a process damage to the display substrate
Laser drilling will cause side effects such as edge cracks and thermal burns, resulting in reduced product reliability and reduced yield.
In addition, for the edge of laser drilling of the display panel, the design of thin film packaging is more difficult, and the packaging reliability is lower. Trouble, the impact of laser drilling
In summary, the existing technology uses laser drilling to reserve space for the camera and infrared sensor of the display product, which makes thin film packaging difficult, low packaging reliability, and will cause process damage to the display panel

Method used

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  • A display panel and display device
  • A display panel and display device
  • A display panel and display device

Examples

Experimental program
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Effect test

Embodiment Construction

[0037] Embodiments of the present application provide a display panel and a display device, which are used to reduce the process difficulty of the thin film packaging of the display panel and improve the reliability of the thin film packaging.

[0038] A display panel provided in an embodiment of the present application, such as figure 1 As shown, the display panel includes: an array substrate 1 and a film structure 2 located on the array substrate 1, the array substrate 1 and the film structure 2 both have a transparent area 3, and the array substrate The transparent area overlaps with the projection of the transparent area of ​​the film layer structure in a direction perpendicular to the display panel;

[0039] The array substrate 1 includes a pixel structure layer 4 and an encapsulation layer 5 located on the pixel structure layer, wherein the pixels 6 in the pixel structure layer are located outside the transparent area, and the transparent area is perpendicular to The or...

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PUM

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Abstract

The present application discloses a display panel and a display device, which are used to reduce the technical difficulty of thin film packaging of the display panel and improve the reliability of the thin film packaging. A display panel provided by an embodiment of the present application, the display panel includes: an array substrate and a film structure on the array substrate, both the array substrate and the film structure have transparent regions, and the array The transparent area of ​​the substrate overlaps with the projection of the transparent area of ​​the film layer structure in a direction perpendicular to the display panel; the array substrate includes a pixel structure layer and an encapsulation layer located on the pixel structure layer, wherein the The pixels in the pixel structure layer are located outside the transparent area, and the orthographic projection of the transparent area in a direction perpendicular to the display panel falls into the orthographic projection of the encapsulation layer in a direction perpendicular to the display panel.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display panel and a display device. Background technique [0002] At present, for a full-screen borderless product, in order to reserve space for a camera and an infrared sensor, it is necessary to perform laser drilling on an Organic Light-Emitting Diode (OLED) display panel. Since laser drilling is a complicated process, it is a process damage to the display substrate. Laser drilling will cause defects such as edge cracks and thermal burns, resulting in side effects such as reduced product reliability and reduced yield. In addition, for the edge of laser drilling of the display panel, the design of thin film packaging is more difficult, and the packaging reliability is lower. Trouble, the impact of laser drilling. To sum up, the existing technology uses laser drilling to reserve space for the camera and infrared sensor of the display product, which makes thin fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L27/12H01L51/52
CPCH01L27/1218H10K59/60H10K59/40H10K59/121H10K50/844H04M1/0266H10K50/87H10K50/868H10K59/65
Inventor 黄炜赟谭文
Owner BOE TECH GRP CO LTD
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