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Fingerprint sensor and its packaging method

A packaging method and sensor technology, which can be applied to measurement devices, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve the problems of fingerprint sensing die damage, etc., and achieve the effect of fast discharge path

Active Publication Date: 2017-11-24
EGIS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a fingerprint sensor and its packaging method to solve the problem that the electrostatic discharge energy above the fingerprint sensor causes damage to the fingerprint sensing crystal grain

Method used

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  • Fingerprint sensor and its packaging method
  • Fingerprint sensor and its packaging method
  • Fingerprint sensor and its packaging method

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Embodiment Construction

[0036] In order to make the above and other purposes, features, and advantages of the present invention more obvious and understandable, preferred embodiments are listed below, together with accompanying drawings and descriptions, and are described in detail as follows:

[0037] figure 1 It shows the electronic device 100 according to an embodiment of the present invention. The electronic device 100 includes a fingerprint sensor 110 and a function module 120 . The fingerprint sensor 110 includes a sensing array 130 and an insulating surface 150 , wherein the sensing array 130 and the insulating surface 150 are disposed in a fingerprint sensing die. To simplify the description, other circuits in the fingerprint sensor 110 (such as the reading circuit, etc.) will not be further described. The sensing array 130 is formed by a plurality of sensing units 135 arranged in a two-dimensional manner, wherein the insulating surface 150 covers all the sensing units 135 of the sensing ar...

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Abstract

The present invention provides a fingerprint sensor. Fingerprint sensors include a multi-layer printed circuit board, a fingerprint sensing die and a mold seal material. The multilayer printed circuit board includes a bottom dielectric layer, at least one intermediate dielectric layer disposed over the bottom dielectric layer, a top dielectric layer disposed over the intermediate dielectric layer, and a trench. The trenches are formed as hollowed-out intermediate dielectric layers and as part of the top dielectric layer. The fingerprint sensing die is disposed in the trench of the multilayer printed circuit board and mounted on the upper surface of the bottom dielectric layer. The fingerprint sensing die includes a sensing array that can sense the fingerprint information of the user. The molding material covers the fingerprint sensing die and fills the grooves of the multilayer printed circuit board. When an ESD event occurs, the electrostatic discharge energy from above the fingerprint sensor can be rapidly transferred through the metal layer to the ground plane of the multi-layer printed circuit board to discharge such that the ESD energy does not cause a fingerprint sensing die damage.

Description

technical field [0001] The present invention relates to a fingerprint sensor, and in particular to a fingerprint sensor and a packaging method thereof. Background technique [0002] In recent years, with the gradual maturity of biometric identification technology, many different biometric features can be used to identify the user's identity. Among them, since the identification rate and accuracy of the fingerprint identification technology are better than other biometric identification technologies, the application level of the fingerprint identification is relatively wide at present. For example, electronic devices such as mobile phones, tablet computers, personal computers, and electronic locks can be equipped with fingerprint recognition functions to identify users. [0003] The fingerprint recognition technology first senses the user's fingerprint pattern, and then captures the unique fingerprint features in the fingerprint pattern and stores them in the memory. Afterw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00
CPCB81B7/0032B81C1/00055B81C1/00095B81C1/00261B81B2201/0292B81C2203/01B81C2201/0174H01L2924/181H01L2224/48091H01L2224/48227H01L23/3121H01L2924/00014H01L23/49811H01L23/49827H01L2924/10161H01L24/48H01L23/60G06V40/1329H01L2924/00012H01L2224/45099H01L23/29H01L23/31H01L23/49822H01L23/5226H03K17/962G06V40/1306H01L24/00H01L21/4853H01L21/4857H01L21/486H01L21/565H01L23/3114H01L23/49838
Inventor 陈品谕
Owner EGIS TECH