Ultrasonic sensing module, its manufacturing method and electronic device
A manufacturing method and ultrasonic technology, which can be applied to devices for coating liquid on surfaces, character and pattern recognition, instruments, etc., can solve the problems of difficult edge packaging of ultrasonic sensing modules, affecting sensitivity, and easily damaged platens. To achieve the effect of easy control, low cost, and prevent the body from rusting
Active Publication Date: 2020-12-15
INTERFACE TECH CHENGDU CO LTD +1
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Problems solved by technology
However, the ultrasonic sensing module with such a laminated structure has the following problems: 1. The surface of each component is uneven or the interface between the components cannot be completely bonded, so that moisture is easy to intrude. In addition, if there is Micro-bubbles or pollutants can also easily lead to moisture intrusion; 2. It is difficult to package the edge of the ultrasonic sensing module; 3. To package the pressure plate, if the material is not selected properly, it will seriously affect the sensitivity of the detection; 4. The pressure plate Easily damaged by scratches or fingerprints due to touching objects, such as unclean fingers
Method used
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[0030] The ultrasonic sensing module provided by the present invention can be used to identify user fingerprints, which includes a main body, the main body has the function of transmitting and receiving ultrasonic waves, and performs fingerprint identification through receiving and emitting ultrasonic waves. The body generally includes an ultrasonic transmitting unit and an ultrasonic receiving unit, and may also include a pressing plate, a TFT array substrate, a flexible circuit board, and the like. The ultrasonic sensing module also includes an encapsulation film, and the encapsulation film is coated on each surface of the body.
[0031] The electronic device provided by the present invention includes an ultrasonic sensing module for identifying user fingerprints. Navigators, etc., can also be accessories, such as watches, bracelets, or household appliances, such as refrigerators, air conditioners, microwave ovens, blood pressure monitors, etc.
[0032] Such as figure 1 As...
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Abstract
An ultrasonic sensing module includes a body, the body has the function of ultrasonic fingerprint identification, and the ultrasonic sensing module also includes an encapsulation film, and the encapsulation film covers each surface of the body. The present invention also provides a method for manufacturing an ultrasonic sensing module, including the steps of: providing a body, the body has the function of ultrasonic fingerprint recognition; forming an encapsulation film on the surface of the body by dip coating, and the encapsulation film covers the Every surface of the body. The invention also provides an electronic device including the ultrasonic sensing module.
Description
technical field [0001] The invention relates to an ultrasonic sensing module, and also relates to a manufacturing method of the ultrasonic sensing module and an electronic device including the ultrasonic sensing module. Background technique [0002] With the development of smart cities, ultrasonic sensing technology is increasingly used in electronic devices, such as mobile phones, watches, tablet computers, blood pressure monitors, etc. Ultrasonic sensing technology can be used to detect biological characteristics, such as fingerprints, heartbeat, pulse, etc. A general ultrasonic sensing module at least includes a transmitting unit for emitting ultrasonic waves, a receiving unit for receiving ultrasonic waves, a pressure plate providing a contact surface with the detection object, a TFT (thin film transistor, thin film transistor) array substrate for receiving and converting signals, Flexible circuit board for input and output signals. These components are stacked in a ce...
Claims
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IPC IPC(8): G06K9/00B05D7/24B05D5/00
CPCB05D5/00B05D7/24B05D2506/10G06V40/1306
Inventor 郑小兵
Owner INTERFACE TECH CHENGDU CO LTD