Composite board

A composite board and composite layer technology, applied in the field of composite boards, can solve the problems of poor gluing stability, separation of the first composite layer and the second composite layer, and unsatisfactory gluing strength, so as to improve the gluing stability, improve the gluing strength, The effect of improving the service life

Inactive Publication Date: 2017-12-08
浙江林境新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Limited by the performance of the existing glue, there is unsatisfactory bonding strength, which affects the performance of the composite board
At the same time, the existing glue can only bond the first composite layer and the second composite layer. As the use time increases, the bonding stability is poor, and the first composite layer and the second composite layer are prone to detachment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 A composite board is shown, comprising a first composite layer 1 and a second composite layer 2, the first composite layer 1 is bonded to the second composite layer 2 through an adhesive layer 3; the adhesive layer 3 is made of a single The component epoxy resin powder is heated and melted.

[0024] The one-component epoxy resin powder includes epoxy resin powder, hydroxypropyl methylcellulose / ionic liquid, allyl succinimidyl carbonate, 2,3,5-trimethylpyrazine, Methyl Bromide Triphenylphosphine Salt, N,N-Bis(Hydroxyethyl) Cocamide, Liquid Nitrile Rubber, Acetylacetonate Salt, Limestone Powder.

[0025] The parts by weight of each component in the rubber powder are: 80 parts of epoxy resin powder, 0.009 part of hydroxypropyl methylcellulose, 0.091 part of 1-ethyl-3-methylimidazolium bromide ionic liquid, and 0.091 part of liquid butyl 0.1 part of nitrile rubber, 0.1 part of aluminum acetylacetonate, 0.1 part of limestone powder, 1 part of allyl succini...

Embodiment 2

[0036] Such as figure 1 A composite board is shown, comprising a first composite layer 1 and a second composite layer 2, the first composite layer 1 is bonded to the second composite layer 2 through an adhesive layer 3; the adhesive layer 3 is made of a single The component epoxy resin powder is heated and melted.

[0037] The parts by weight of each component in the rubber powder are: 100 parts of epoxy resin raw powder, 0.454 parts of hydroxypropyl methylcellulose, 4.54 parts of 1-butyl-3 methylimidazole chloride ionic liquid, liquid butyronitrile 10 parts of rubber, 3 parts of magnesium acetylacetonate, 1 part of limestone powder, 3 parts of allyl succinimidyl carbonate, 1.5 parts of 2,3,5-trimethylpyrazine, 0.75 parts of methyl bromide triphenylphosphine , 0.5 parts of N,N-di(hydroxyethyl)cocamide;

[0038] The liquid nitrile rubber is liquid nitrile rubber-34. The molecular weight of liquid nitrile rubber-34 is 3800-4500, the viscosity is 450pa.s when the temperature i...

Embodiment 3

[0048] Such as figure 1 A composite board is shown, comprising a first composite layer 1 and a second composite layer 2, the first composite layer 1 is bonded to the second composite layer 2 through an adhesive layer 3; the adhesive layer 3 is made of a single The component epoxy resin powder is heated and melted.

[0049] The parts by weight of each component in the rubber powder are: 120 parts of epoxy resin raw powder, 0.91 parts of hydroxypropyl methylcellulose, 9.01 parts of 2-ethyl-4-methylimidazolium bromide ionic liquid, and 9.01 parts of liquid butyl 20 parts of nitrile rubber, 6 parts of cobalt acetylacetonate, 2 parts of limestone powder, 5 parts of allyl succinimidyl carbonate, 2 parts of 2,3,5-trimethylpyrazine, 1 part of methyl bromide triphenylphosphine 0.7 parts, N, N-two (hydroxyethyl) cocamides;

[0050] The liquid nitrile rubber is liquid nitrile rubber-40. Liquid nitrile rubber-40 has a molecular weight of 6000-8000, a viscosity of 850 pa.s when the temp...

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Abstract

The invention discloses a composite board which comprises a first composite layer and a second composite layer, wherein the first composite layer is connected with the second composite layer through an adhesive layer in an adhered manner; the adhesive layer is formed by heating and melting single-component epoxy resin rubber powder. According to the composite board disclosed by the invention, due to the adhesive layer, the bonding strength between the composite layers is improved, and the bonding stability of the composite layer can be improved, so that the overall service life of the composite board is prolonged.

Description

technical field [0001] The invention relates to a composite board. Background technique [0002] The first composite layer and the second composite layer of the existing composite board are all made by bonding with glue. Limited by the performance of the existing glue, the bonding strength is not ideal, which affects the performance of the composite board. At the same time, the existing glue can only bond the first composite layer and the second composite layer, and as the use time increases, its bonding stability is poor, and the first composite layer and the second composite layer are prone to detachment. Contents of the invention [0003] The object of the present invention is to provide a composite board. The arrangement of the adhesive layer not only improves the bonding strength between the composite layers, but also improves the bonding stability of the composite layers, thereby improving the overall service life of the composite board. [0004] In order to achiev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC09J11/04C09J11/06C09J11/08C09J163/00C08K2003/265C08L2205/03C08L1/284C08L9/02C08K13/02C08K5/3462C08K5/50C08K5/20C08K3/26
Inventor 朱峻毅
Owner 浙江林境新材料科技有限公司
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