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Circuit Board Assembly And Mehtod For Manufacturing The Same

A technology for circuit substrates and assemblies, applied in circuits, printed circuits, printed circuits, etc., can solve problems such as high melting point and inability to solder other components to connecting terminals

Inactive Publication Date: 2017-12-08
JTEKT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for example, in the case of nickel plating, since nickel has a higher melting point than copper, which is the material of the connection terminal, there is a problem that other parts cannot be soldered to the connection terminal (terminal).

Method used

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  • Circuit Board Assembly And Mehtod For Manufacturing The Same
  • Circuit Board Assembly And Mehtod For Manufacturing The Same
  • Circuit Board Assembly And Mehtod For Manufacturing The Same

Examples

Experimental program
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Embodiment Construction

[0023] Below, refer to Figure 1 to Figure 9 A circuit board assembly, a final circuit board assembly, and a method for manufacturing the final circuit board assembly according to one embodiment of the present invention will be described. Such as figure 1 , figure 2 As shown, the circuit board assembly 10 is composed of a circuit board 20 and a cover 30 covering a part of the circuit board 20 .

[0024] Such as figure 2 As shown, the circuit board 20 is formed in a substantially quadrilateral plate shape and has a first board plane 20a (refer to image 3 ) and the second substrate plane 20b. In addition, in this specification as figure 1 As shown, the direction in which the cable 15 described later extends is referred to as the longitudinal direction, and the direction perpendicular to the longitudinal direction and the thickness direction of the circuit board 20 is referred to as the width direction. exist figure 2 In the thickness direction, the lower surface of t...

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PUM

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Abstract

Provided are a circuit board assembly that can prevent contact between connection terminals due to whiskers even if whiskers grow from the connection terminals and a method for manufacturing an insert molded product. A cover body of the circuit board assembly has a plurality of partition walls (12) that form a plurality of grooves (M) each accommodating a corresponding one of connection terminals (27). The partition walls (12) restrain the inner surface of a second cover (50) of the cover body from entering the grooves (M) when an external pressure is applied to a part of the cover body which covers the connection terminals (27). The partition walls (12) also prevent contact between adjoining ones of the connection terminals (27) when whiskers grow.

Description

technical field [0001] The present invention relates to a circuit board assembly and a method for manufacturing the circuit board assembly. Background technique [0002] Conventionally, a circuit board assembly in which a circuit board having electronic components is covered with a cover is disclosed in JP-A-2015-191995. In Japanese Patent Application Laid-Open No. 2015-191995 image 3 In the circuit board, the periphery of the circuit board is sandwiched by wave-shaped deforming parts respectively provided on the edge parts of the pair of covers, and a plurality of connection terminals for external connection extend and protrude from the circuit board. [0003] Conventionally, tin, which has a beautiful silver-white appearance in air and has a relatively low electrical resistance, has been widely subjected to plating treatment on connection terminals. However, in the case of tin-plated connection terminals, it is known that tin whiskers are generated. The mechanism of thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06
CPCH05K5/069H01R9/03H01R12/75H01R13/582H05K2201/10189H01R13/506H01R13/665H01R24/62H01R43/205H01R2107/00H05K1/181
Inventor 外山祐一
Owner JTEKT CORP
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