Epoxy composite material with high heat conductivity and preparation method thereof

A composite material, high thermal conductivity technology, applied in the direction of heat exchange materials, chemical instruments and methods, can solve the problems of large interlayer thermal resistance, disordered graphene stacking, large gaps, etc., to achieve the effect of high thermal conductivity

Active Publication Date: 2017-12-12
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the graphene stacking in the graphene three-dimensional sponge obtained by this method is relatively chaotic, and the gaps between the graphene nanosheets are relatively large, so large interlayer thermal resistance will be generated.

Method used

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  • Epoxy composite material with high heat conductivity and preparation method thereof
  • Epoxy composite material with high heat conductivity and preparation method thereof
  • Epoxy composite material with high heat conductivity and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Prepare a uniform mixture of epoxy resin and curing agent. Weigh 60 g of bisphenol A epoxy resin, then add 20 g of p-chloroaniline methane, stir magnetically for 1 h at 100 °C to fully dissolve the curing agent, and obtain a uniform mixed solution;

[0028] (2) The epoxy mixture prepared in the previous step was cast into a commercial melamine sponge, and then degassed several times under a certain degree of vacuum at 120 °C, so that the epoxy fully filled the pores inside the sponge. Subsequently, the temperature was raised to 150 °C for pre-curing for 2 h, and then the temperature was further increased to 180 °C for curing for 2.5 h. Demoulding gave the final composite material, denoted EP / MF.

Embodiment 2

[0030] (1) Weigh 2 g of boron nitride into 200 ml of isopropanol, sonicate for 18 h at room temperature in a 250W sonicator, and then centrifuge at 1000 rpm for 20 min, and take the boron nitride nanosheets ( BNNS) dispersion liquid for use, the concentration of dispersion liquid is about 1 mg / ml; then add 25 ml of deionized water to 25 ml of peeled BNNS dispersion liquid to prepare 0.5 mg / ml BNNS isopropanol / water dispersion liquid ;

[0031] (2) Disperse graphene oxide (GO) in water to obtain a uniform dispersion with a concentration of 1 mg / ml;

[0032] (3) Prepare an aqueous solution of polyethyleneimine (PEI) with a concentration of 1 mg / ml;

[0033] (4) A commercial melamine sponge of a certain size was first soaked in PEI aqueous solution for 2 min, rinsed with deionized water for several times, and then immersed in GO aqueous dispersion or BNNS isopropanol / water dispersion for 2 min. Then rinse the sponge several times with deionized water. Repeat the above steps fo...

Embodiment 3

[0039] (1) Weigh 2 g of boron nitride into 200 ml of isopropanol, sonicate for 18 h at room temperature in a 250W sonicator, and then centrifuge at 1000 rpm for 20 min, and take the boron nitride nanosheets ( BNNS) dispersion liquid for use, the concentration of dispersion liquid is about 1 mg / ml; then add 25 ml of deionized water to 25 ml of peeled BNNS dispersion liquid to prepare 0.5 mg / ml BNNS isopropanol / water dispersion liquid ;

[0040] (2) Disperse graphene oxide (GO) in water to obtain a uniform dispersion with a concentration of 1 mg / ml;

[0041] (3) Prepare an aqueous solution of polyethyleneimine (PEI) with a concentration of 1 mg / ml;

[0042] (4) A commercial melamine sponge of a certain size was first soaked in PEI aqueous solution for 2 min, rinsed with deionized water for several times, and then immersed in GO aqueous dispersion or BNNS isopropanol / water dispersion for 2 min. Then rinse the sponge several times with deionized water. Repeat the above steps fo...

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Abstract

The invention belongs to the technical field of a heat conduction polymer composite material, and particularly relates to an epoxy composite material with high heat conductivity and a preparation method thereof. Firstly, electronegative graphene oxide nanosheets or boron nitride nanosheets are repeatedly deposited on the surface of commercial melamine sponge through layer-by-layer self assembly; a composite sponge framework with a three-dimensional filling network is formed; then, the composite sponge is subjected to epoxy resin encapsulation; the final heat conduction composite material is obtained. The materials can build and form a three-dimensional heat conduction network under the condition of extremely low filling adding quantity; when the boron nitride content is 1.7 weight percent and the graphene content is 0.74 weight percent, the heat conductivity in the vertical surface of the materials respectively reaches 0.62 W / Mk and 0.73 W / Mk. The method has the advantages that the operation is simple; the production cost is very low; the batch and scale production is easily realized; wide application prospects are realized.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive polymer composite materials, and particularly relates to an epoxy-based composite material and a preparation method thereof. Background technique [0002] Various types of precision electronic and industrial equipment often generate a large amount of heat during use. If the heat generated cannot be dissipated in a timely and effective manner, it may cause a reduction in the working efficiency or even failure of the equipment. Therefore, effective thermal management of various electronic power equipment is the key to ensure the safe and stable operation of the equipment. Polymer materials are widely used in power industry as load-bearing members or adhesives due to their easy processing, light weight and low cost. However, the thermal conductivity of polymers is usually relatively low, basically between 0.1-0.3 W / mK. For example, for epoxy resin, which is widely used as electronic pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/28C08L79/02C08K9/00C08K3/38C08K3/04C09K5/14
Inventor 王雄伟武培怡
Owner FUDAN UNIV
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