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Cutting method for optimizing metal bur of side-wall metal substrate

A cutting method and metallization technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of metal layer burrs, cutting waste products, etc., and achieve the effect of avoiding cutting phase angles, debris and metal wire drawing

Active Publication Date: 2017-12-12
四川科尔威光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the traditional cutting and separation, the entire chip is mounted on mylar (polyester film) to fix and protect, but only the contact surface between the chip and mylar will be protected. During the cutting process, the metal layer on the side will be pulled up and cause burrs , resulting in cutting waste

Method used

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  • Cutting method for optimizing metal bur of side-wall metal substrate

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Embodiment Construction

[0016] Describe technical scheme of the present invention in further detail below in conjunction with accompanying drawing: as figure 1 As shown, a cutting method for optimizing metal burrs of sidewall metallized substrates comprises the following steps:

[0017] S1: place the slide on a hot plate to heat;

[0018] S2: Apply adhesive wax evenly on the carrier, slowly and steadily place the chip on the carrier, press the chip properly to ensure that there are no large air bubbles between the chip and the carrier, and the chip and the carrier are relatively horizontal to avoid the side wall of the chip after cutting. tilt;

[0019] S3: Wrap the entire chip with adhesive wax;

[0020] S4: Paste the slide with the chip bonded on the mylar film;

[0021] S5: cutting the slide;

[0022] S6: After cutting and separating, clean the chip with acetone to wash off the bonding wax.

[0023] More preferably, in this embodiment, the slide is a glass slide.

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Abstract

The invention discloses a cutting method for optimizing metal bur of a side-wall metal substrate. The cutting method comprises the following steps of S1, placing slide glass on a heating plate for heating; S2, uniformly coating bonding wax on the slide glass, and pasting a chip onto the slide glass; S3, coating the bonding wax to wrap the whole chip; S4, laminating the slide glass pasted with the chip onto a mylar film; S5, cutting the slide glass; and S6, cleaning the chip with acetone after cutting and separation, and cleaning the bonding wax. The chip to be cut is wrapped and pasted onto the slide glass (a conventional glass sheet) by the bonding wax, so that all surfaces of the chip are protected, and debris and metal wiredrawing caused by cutting are prevented; and meanwhile, the chip is pasted onto the slide glass, the chip can be cut deeply, and a cut phase angle is prevented.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a cutting method for optimizing metal burrs on a sidewall metallization substrate. Background technique [0002] In the current manufacturing of semiconductor devices, it is sometimes required to have a patterned metal structure on the side of the chip and connect it with the pattern on the front to realize some unique functions of the chip. After the full-page product graphic production is completed, it needs to be cut and separated into independent units. [0003] In traditional cutting and separation, the full-page chip will be fixed and protected on mylar (polyester film), but only the contact surface between the chip and mylar will be protected. During the cutting process, the metal layer on the side will be pulled up and cause burrs , resulting in cutting waste. Contents of the invention [0004] The purpose of the present invention is to over...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78
CPCH01L21/78
Inventor 孙洪权李建李俊霖
Owner 四川科尔威光电科技有限公司
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