Clamping alignment device and method

Abstract

The invention provides a clamping aligning device and method. The device comprises a plurality of clamping aligning mechanisms and at least one driving device. The plurality of clamping aligning mechanisms are distributed around a to-be-clamped substrate. Each of the plurality of clamping aligning mechanisms comprises a lifting aligning portion and a clamping portion. The cross section of the lifting aligning portion is elliptical, the clamping portion is arranged on one end of the lifting aligning portion and protrudes out of the lifting aligning portion, the protruding direction of the clamping portion and the extending direction of a short shaft of the cross section of the lifting aligning portion form an included angle, the lifting aligning portion is connected to the driving device, the driving device can drive the lifting aligning portion to lift and rotate between a first position and a second position, and the lifting aligning portion drives the clamping portion to lift and rotate in a direction far from the substrate and above the substrate. The clamping aligning device and method provided by the invention have the advantages that the driving device drives the lifting aligning portion and the clamping portion, so that the clamping aligning device is high in aligning and clamping precision; the speed and position can be adjusted freely, the fragment risk can be effectively reduced, and the production efficiency of a machine table is increased.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to a clamping and positioning device and method for positioning and clamping a substrate to be sputtered in a physical sputtering film forming chamber. Background technique [0002] In the production process of thin-film transistor (TFT) substrates, metal films such as Al, Mo, Ti, Cu, Ag and non-metal films such as ITO and IGZO need to be deposited on the surface of the substrate. The deposition of these films is usually performed by physical vapor deposition (PVD) )Finish. Since the TFT substrate is made of glass, the thickness is usually only 0.4-0.5mm, and the glass substrate needs to be kept upright during film formation, and the problem of substrate cracking in the film formation chamber is prone to occur during the process. The physical vapor deposition machine is a vacuum-type machine. Once glass fragments occur, it often takes a long time to clean up the fragments. In...

AI Technical Summary

Problems solved by technology

[0004] The disadvantage of the above-mentioned clamping device is that the switch of the clamping part 11 is realized by the lifting and lowering of the lifting part 13 and the elastic force of the spring, the clamping speed and strength are not easy to control, and the clamping height needs to be opened and the clamping part should be adjusted with a jig The installation position cannot be adjusted when the chamber is closed, and the clamping status cannot be monitored in real time when the chamber is closed, and it cannot be found in time when an abnormality occurs, which will have a certain impact on the stable production of the machine.

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