Damping type anti-static high temperature resistant double-sided electronic adhesive tape

An antistatic high temperature resistant, electronic adhesive tape technology, applied in the direction of non-polymer adhesive additives, adhesives, epoxy resin glue, etc., to achieve excellent comprehensive performance, broad market prospects, and improve the effect of shock absorption and protection performance

Inactive Publication Date: 2017-12-22
SUZHOU TEXIN PRECISION ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide a shock-absorbing antistatic high temperature

Method used

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  • Damping type anti-static high temperature resistant double-sided electronic adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A shock-absorbing antistatic and high temperature resistant double-sided electronic adhesive tape, comprising: a substrate 1, a pressure-sensitive adhesive layer 2 adhered to both sides of the substrate 1, and a release paper 3 adhered to the outside of the pressure-sensitive adhesive layer 2.

[0017] Wherein, the substrate 1 is a biaxially stretched PET film composite layer covered with a polyacrylate foam layer, specifically, the density of the foam layer is 0.85-0.90 g / cm 3 ; The thickness of the one-sided foam layer in the matrix is ​​0.05-0.15mm. The biaxially stretched PET film ensures that the molded colloid has excellent toughness and high temperature resistance, and the foam layer coating design gives the tape good shock absorption and protection performance.

[0018] The pressure-sensitive adhesive layer 2 is an antistatic pressure-sensitive adhesive, including the following components in parts by weight: 25-30 parts of high-temperature-resistant modified epo...

Embodiment 2

[0020] The difference from Example 1 is that an antistatic film layer 4 is also adhered between the pressure-sensitive adhesive layer 2 and the release paper layer 3 .

[0021] The above-mentioned electronic tape has the following advantages after testing: the shear strength reaches above 182MPa, the high temperature resistance is 40°C higher than that of the existing electronic tape, and the antistatic test requirements are qualified.

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Abstract

The invention discloses a damping type anti-static high temperature resistant double-sided electronic adhesive tape. The electronic adhesive tape comprises a base, voltage-sensitive adhesive layers adhered onto two sides of the base and release paper adhered onto the outer sides of the voltage-sensitive adhesive layers, wherein the base adopts a foaming layer coated bidirectional stretching PET film composite layer; the voltage-sensitive adhesive layers are made of anti-static voltage-sensitive adhesives. According to the damping type anti-static high temperature resistant double-sided electronic adhesive tape disclosed by the invention, through the design of the base and the voltage-sensitive adhesive, the damping protection performance, high temperature resistance and anti-static performance of the electronic adhesive tape are effectively improved, particularly, double-layer anti-static protection is carried out on the electronic adhesive tape by adopting an anti-static film, and the obtained electronic adhesive tape is excellent in comprehensive performance and wide in market prospect.

Description

technical field [0001] The invention relates to the field of adhesive tapes, in particular to a shock-absorbing antistatic and high temperature resistant double-sided electronic adhesive tape. Background technique [0002] With the development of science and technology, many electronic components need to be fixed and installed, and adhesive tape has become an indispensable item in the electronics and electrical industries. [0003] The main problems existing in the actual use of the existing double-sided electronic tape mainly focus on the following aspects: 1. The miniature and ultra-thin make the anti-seismic protection performance poor; 2. The antistatic performance is poor, especially in electronic components. The safety used in circuit boards is insufficient; 3. The high temperature resistance is poor, and the performance decreases after high temperature use, and it cannot be completely removed, and the damage is basic. Contents of the invention [0004] The main tec...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J163/00C09J11/04
CPCC08K3/36C08K2201/011C09J11/04C09J163/00C09J2203/326C09J2463/00C09J2301/162C09J2301/408
Inventor 方国章
Owner SUZHOU TEXIN PRECISION ELECTRONICS CO LTD
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