Damping type anti-static high temperature resistant double-sided electronic adhesive tape
An antistatic high temperature resistant, electronic adhesive tape technology, applied in the direction of non-polymer adhesive additives, adhesives, epoxy resin glue, etc., to achieve excellent comprehensive performance, broad market prospects, and improve the effect of shock absorption and protection performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0016] A shock-absorbing antistatic and high temperature resistant double-sided electronic adhesive tape, comprising: a substrate 1, a pressure-sensitive adhesive layer 2 adhered to both sides of the substrate 1, and a release paper 3 adhered to the outside of the pressure-sensitive adhesive layer 2.
[0017] Wherein, the substrate 1 is a biaxially stretched PET film composite layer covered with a polyacrylate foam layer, specifically, the density of the foam layer is 0.85-0.90 g / cm 3 ; The thickness of the one-sided foam layer in the matrix is 0.05-0.15mm. The biaxially stretched PET film ensures that the molded colloid has excellent toughness and high temperature resistance, and the foam layer coating design gives the tape good shock absorption and protection performance.
[0018] The pressure-sensitive adhesive layer 2 is an antistatic pressure-sensitive adhesive, including the following components in parts by weight: 25-30 parts of high-temperature-resistant modified epo...
Embodiment 2
[0020] The difference from Example 1 is that an antistatic film layer 4 is also adhered between the pressure-sensitive adhesive layer 2 and the release paper layer 3 .
[0021] The above-mentioned electronic tape has the following advantages after testing: the shear strength reaches above 182MPa, the high temperature resistance is 40°C higher than that of the existing electronic tape, and the antistatic test requirements are qualified.
PUM
Property | Measurement | Unit |
---|---|---|
Density | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Shear strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com