Probe test bench for semiconductor processing
A semiconductor and test bench technology, applied in the direction of single semiconductor device testing, measuring electricity, measuring devices, etc., can solve the problems of inconvenient heat dissipation and cooling of test instruments, inconvenient influence of electrical conductivity, complex test equipment, etc.
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Embodiment 1
[0038] refer to Figure 1-6 , a probe test bench for semiconductor processing, comprising a base 1, a test platform 2, the test platform 2 is located on the base 1, the test platform 2 is provided with a test mechanism, the base 1 is provided with a test instrument 101, the test mechanism and the test instrument 101 are electrically connected, the test platform 2 is provided with a moving slot 5, and a fixed plate 6 is slidably connected in the moving slot 5. The fixed plate 6 is provided with a placement slot 601, and the fixed plate 6 is provided with a cavity 602. The cavity 602 is located below the placement groove 601, a heat conduction plate is provided between the cavity 602 and the placement groove 601, a threaded rod 501 is rotationally connected in the moving groove 5, and a threaded connection is made between the fixed plate 6 and the threaded rod 501, and the fixed plate 6 is provided with There is a clamping mechanism, the base 1 is connected with a first rotating...
Embodiment 2
[0041] refer to Figure 1-6 , a probe test bench for semiconductor processing, which is basically the same as Embodiment 1, and furthermore, the test mechanism includes a support frame 3, and the support frame 3 is rotatably connected with a first electric telescopic rod 301, and the first electric telescopic rod 301 The telescopic end of the second electric telescopic rod 302 is fixedly connected with the second electric telescopic rod 302, and the telescopic end of the second electric telescopic rod 302 is fixedly connected with the probe part 303, and the probe part 303 matches the fixed plate 6, the first electric telescopic rod 301, the second The setting of the electric telescopic rod 302 is convenient for adjusting the position of the probe part 303 .
Embodiment 3
[0043] refer to Figure 1-6 , a probe test bench for semiconductor processing, which is basically the same as Embodiment 1, furthermore, the first driving mechanism includes a cam 901, and the edge of the side wall of the cam 901 is slidingly connected with a second push rod 122, and the exhaust mechanism Including the second cylinder 12, the second cylinder 12 is slidably connected with the second piston 121, the end of the second push rod 122 away from the cam 901 is fixedly connected with the second piston 121, the second cylinder 12 is provided with a second intake pipe 123, A second exhaust pipe 124 is connected between the second cylinder 12 and the air chamber 13, and a check valve is arranged on the second intake pipe 123 and the second exhaust pipe 124, and the cam 901 drives the second push rod 122 to The piston 121 slides reciprocally in the second cylinder 12, and discharges outside air into the air chamber 13 along the second intake pipe 123 and the second exhaust...
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