Cooling device for CPU (Central Processing Unit)

Abstract

The invention discloses a cooling device for a CPU (Central Processing Unit). The cooling device comprises a dust chamber and a cooling chamber, wherein the dust chamber comprises a filtering layer and a connection board; a filter net is arranged in the filter layer; a fan blade is arranged in the cooling chamber; the top of the fan blade is provided with a round block; a motor is arranged in the round block; the motor is connected with the fan blade through a rotation shaft; and the round block is provided with a bracket. By use of the cooling device for the CPU, the bottom of a conducting strip is provided with heat conduction silica gel, the heat conduction silica gel can more favorably transfer the heat of the CPU to the conducting strip, and therefore, heat can be dispersed in time; the fan blade is arranged on the upper end of the CPU, and the fan blade can disperse heat by aiming at the CPU to disperse the heat in time; in addition, the fan blade is arranged in a heat conduction chamber, so that air sent from the fan blade flows between the conducting strips, the heat dispersing speed of the conducting strips can be greatly quickened, and dust in air can be effectively removed through the dust chamber.

Description

technical field [0001] The invention relates to the technical field of computer accessories, in particular to a cooling device for a CPU. Background technique [0002] Computer (computer), commonly known as computer, is an electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. With the rapid development of the computer industry, the processing power of the computer is getting stronger and stronger, and the computing power of the CPU is also increasing day by day, and the resulting heat dissipation is also becoming more and more serious. If the heat in the computer is not evacuated quickly, it will seriously affect t...

AI Technical Summary

Problems solved by technology

With the rapid development of the computer industry, the processing power of the computer is getting stronger and stronger, and the computing power of the CPU is also increasing day by day, and the resulting heat dissipation is also becoming more and more serious. If the heat in the computer is not evacuated quickly, it will seriously affect the performance of the computer. , its ability will not be fully utilized

The current CPU cooling device usually installs the heat dissipation blades on the upper end of the heat conduction sheet, and the heat on the heat conduction sheet is evacuated through the heat dissipation blades. Since the heat dissipation blades are arranged on the upper end of the heat conduction sheet, the heat dissipation blades cannot effectively dissipate heat for the CPU. , causing the heat to not be evacuated in time, which seriously affects the performance of the computer, and after the user uses it for a long time, dust is easy to accumulate on the cooling device, which affects the heat dissipation effect, and excessive dust accumulation on the circuit board will also seriously affect the performance of the computer. affect computer performance

Images