Cooling device for CPU (Central Processing Unit)

Abstract

The invention discloses a CPU heat dissipation device, which comprises a dust removal chamber and a heat dissipation chamber, the dust removal chamber includes a filter layer and a connecting plate, a filter screen is arranged inside the filter layer, and fan blades are arranged inside the heat dissipation chamber , the top of the fan blade is provided with a circular block, the interior of the circular block is provided with a motor, the motor is connected to the fan blade through a rotating shaft, and a bracket is provided on the circular block. The heat sink of the CPU is equipped with thermal silica gel at the bottom of the heat conduction sheet. The heat conduction silica gel can better transmit the heat of the CPU to the heat conduction sheet, so that the heat can be evacuated in time. It can dissipate the heat in time for the CPU, and the fan blades are arranged inside the heat conduction chamber, so that the air blown by the fan blades flows between the heat conduction fins, which greatly speeds up the heat evacuation speed of the heat conduction elements. Through the dust removal chamber, it can Effectively remove dust in the air.

Description

technical field [0001] The invention relates to the technical field of computer accessories, in particular to a cooling device for a CPU. Background technique [0002] Computer (computer), commonly known as computer, is an electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. With the rapid development of the computer industry, the processing power of the computer is getting stronger and stronger, and the computing power of the CPU is also increasing day by day, and the resulting heat dissipation is also becoming more and more serious. If the heat in the computer is not evacuated quickly, it will seriously affect t...

AI Technical Summary

Problems solved by technology

With the rapid development of the computer industry, the processing power of the computer is getting stronger and stronger, and the computing power of the CPU is also increasing day by day, and the resulting heat dissipation is also becoming more and more serious. If the heat in the computer is not evacuated quickly, it will seriously affect the performance of the computer. , its ability will not be fully utilized

The current CPU cooling device usually installs the heat dissipation blades on the upper end of the heat conduction sheet, and the heat on the heat conduction sheet is evacuated through the heat dissipation blades. Since the heat dissipation blades are arranged on the upper end of the heat conduction sheet, the heat dissipation blades cannot effectively dissipate heat for the CPU. , causing the heat to not be evacuated in time, which seriously affects the performance of the computer, and after the user uses it for a long time, dust is easy to accumulate on the cooling device, which affects the heat dissipation effect, and excessive dust accumulation on the circuit board will also seriously affect the performance of the computer. affect computer performance

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