Photosensitive assembly, shooting module group and manufacture method thereof

A technology of photosensitive components and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, image communication, electrical components, etc., and can solve problems such as abnormal curves, chip 1P edge fragmentation, and optical axis inconsistency

Active Publication Date: 2017-12-26
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this process, when molding the molding support 6P, the edge area of ​​the chip 1P will be pressed by the mold, and the chip 1P and the circuit through the traditional D/A process There is the floating area 4P between the boards 2P, and this kind of pressing can easily cause the chip 1P to tilt, and even cause the edge of the chip 1P to crack due to uneven force
Therefore, in order to ensure better optical ax...

Method used

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  • Photosensitive assembly, shooting module group and manufacture method thereof
  • Photosensitive assembly, shooting module group and manufacture method thereof
  • Photosensitive assembly, shooting module group and manufacture method thereof

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Embodiment Construction

[0070] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0071] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

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Abstract

Disclosed are a photosensitive assembly, a shooting module group and a manufacture method thereof. The photosensitive assembly comprises a circuit board body, a photosensitive chip and a connection medium, wherein the photosensitive chip is attached to the circuit board body through the connection medium, and the connection medium and the photosensitive chip are matched with each other in shape, so that the photosensitive chip is flatly connected to the circuit board body.

Description

technical field [0001] The invention relates to the field of camera modules, and further relates to a photosensitive component, a camera module and a manufacturing method thereof. Background technique [0002] The consistency of the optical axis is an important factor affecting the imaging quality of the camera module, and the consistency of the optical axis mainly refers to the coaxiality between the central axis of the photosensitive chip and the main optical axis of the lens, so D / A (Die / Attach chip The attachment) process is an important process in the assembly and manufacturing process of the camera module. [0003] refer to Figure 1A and 1B It is the chip and circuit board after the D / A process in the traditional camera. In a traditional camera module, a chip 1P is usually attached to a circuit board 2P, that is, a D / A process, that is, firstly, a thermosetting conductive adhesive or an insulating adhesive is coated on the surface 2P of the circuit board according t...

Claims

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Application Information

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IPC IPC(8): H01L23/10H01L21/60H04N5/225
CPCH01L24/29H01L24/83H01L2224/29023H01L2224/83365H04N23/54H04N23/55H01L2224/83101H01L2224/83191H01L2224/83192H01L2224/8592H01L2224/92247H01L2924/1815H01L2224/2744H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/00014H01L2924/00
Inventor 王明珠栾仲禹张海中郭楠黄桢
Owner NINGBO SUNNY OPOTECH CO LTD
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