Lightweight sound-absorption heat-insulation polyimide foamed material, and preparation method thereof

A technology of polyimide and foam materials, which is applied in the field of light-weight sound-absorbing and heat-insulating polyimide foam materials and its preparation, can solve the problems of unsatisfactory dimensional stability, increased cell pressure difference, and The wall strength is weak and other problems, and the foaming process is simple and easy to control, the performance is stable, and the effect of sound absorption and heat insulation is strong.

Active Publication Date: 2018-01-05
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the cell structure is unstable or not firm at the initial stage of curing, the strength of the cell wall is weak, and the further volatilization of the residual solvent and blowing agent increases the pressure difference of the cells, and the foam shrinks under the action o

Method used

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  • Lightweight sound-absorption heat-insulation polyimide foamed material, and preparation method thereof
  • Lightweight sound-absorption heat-insulation polyimide foamed material, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Take a 500ml four-neck flask, add 200g of dimethylformamide, 16g of anhydrous methanol, 6g of PEG600, and 10g of simethicone, stir well, raise the temperature to 70°C, add 100g of pyromellitic dianhydride, and wait until the solution After being transparent, the temperature was lowered to below 40° C., and then 8 grams of deionized water was added and stirred for 30 minutes to obtain a brownish yellow transparent precursor solution.

[0044] Weigh 50 grams of the above precursor solution, add 36 grams of 4,4'-diphenylmethane diisocyanate, stir rapidly for 10 seconds, pour it into the prepared mold, release it after free foaming for 1 minute, and put it in the microwave oven , treated at 40-50°C for 10 minutes to obtain a yellow foam preform, which was placed in an oven, heated to 280°C in vacuum, and maintained for 4 hours to obtain the polyimide foam of the present invention.

[0045] The basic performance parameters of the foam prepared by Test Example 1 are as follow...

Embodiment 2

[0048] Take a 500ml four-necked flask, add 200g of dimethylformamide, 16g of anhydrous methanol, 6g of PEG600, and 10g of simethicone, stir well, raise the temperature to 70°C, add 120g of pyromellitic dianhydride, and wait for the solution After becoming transparent, the temperature was lowered to below 40° C., and then 9 g of deionized water was added and stirred for 30 minutes to obtain a brown-yellow transparent precursor solution.

[0049] Weigh 50 grams of the above precursor solution, add 37 grams of 4,4'-diphenylmethane diisocyanate, stir rapidly for 10 seconds, pour it into the prepared mold, release it after free foaming for 1 minute, and put it in a microwave oven , treated at 40-50°C for 10 minutes to obtain a yellow foam preform, which was placed in an oven, heated to 280°C in vacuum, and maintained for 4 hours to obtain the polyimide foam of the present invention.

[0050] The basic performance parameters of the foam prepared by Test Example 2 are as follows:

...

Embodiment 3

[0053] Take a 500ml four-neck flask, add 200g of dimethylformamide, 16g of anhydrous methanol, 5g of PEG600, and 12g of simethicone, stir well, raise the temperature to 70°C, add 120g of benzophenonetetraacid dianhydride, wait After the solution was transparent, the temperature was lowered to below 40° C., and then 7 g of deionized water was added and stirred for 30 minutes to obtain a light yellow transparent precursor solution.

[0054] Weigh 50 grams of the above precursor solution, add 36 grams of polymethyl polyphenylisocyanate, stir rapidly for 10 seconds, pour it into the prepared mold, release it after free foaming for 1 minute, put it in a microwave oven, 50-60 temperature for 20 minutes to obtain a yellow foam preform, put it in an oven, raise the temperature to 270° C. in vacuum, and maintain it for 6 hours to obtain the polyimide foam of the present invention.

[0055] The basic performance parameters of the foam prepared by Test Example 3 are as follows:

[0056]...

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Abstract

The invention discloses a lightweight sound-absorption heat-insulation polyimide foamed material, and a preparation method thereof. The preparation method comprises following steps: an aromatic dianhydride, a low molecular alcohol, a surfactant, and an auxiliary agent are mixed at a certain ratio, and are reacted in a polar solvent so as to obtain a foam precursor solution; the foam precursor solution is reacted with isocyanate in a mould, and semi-free foaming is carried out so as to obtain a foam intermediate; microwave radiation treatment, and heating curing in an aging oven are carried outso as to obtain the lightweight sound-absorption heat-insulation polyimide foamed material. The preparation route is short; the preparation method is simple; the foam precursor solution is low in viscosity and high in stability, is suitable for casting and extrusion process; the foaming process is simple, and is convenient to control; defects such as cracking, collapsing, nonuniformity, and incomplete material imidization are avoided; the obtained lightweight sound-absorption heat-insulation polyimide foamed material is high in stability and strength, is low in density, possesses excellent sound absorption and heat insulation performance, and can be widely used in fields such as aerospace, ship, automobile, refrigeration house, and other special application fields.

Description

Technical field: [0001] The invention relates to the technical field of polymer materials, in particular to a lightweight sound-absorbing and heat-insulating polyimide foam material and a preparation method thereof. Background technique: [0002] Polyimide foam material is a new type of lightweight material with a specific chemical structure, high and low temperature resistance range of -250°C to 450°C, and no release of harmful substances. It has excellent heat insulation and sound absorption properties, and good dielectric properties. performance, good flexibility, strength can be designed, radiation resistance, solvent resistance, flame retardant and low smoke and other properties. Therefore, polyimide foam is widely used as key materials for heat insulation, shock absorption and noise reduction in high-tech fields such as aerospace, military industry, ships and microelectronics. [0003] At present, there are many preparation methods for polyimide foam materials. U.S. p...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J9/08C08L79/08C08L83/04
Inventor 陈云传姚建忠边宏伟陆企亭
Owner 康达新材料(集团)股份有限公司
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