Method for improving multi-layer board borehole deviation

Abstract

The invention relates to a method for improving multi-layer board borehole deviation. The method includes the steps: S1 performing X-RAY target drilling; S2 measuring actual expansion and contractiondata of boards, and calculating an expansion and contraction average value; S3 setting an X-RAY multi-layer board target drilling expansion and contraction range to be lower than or equal to 75 micrometers, and performing board running on the boards exceeding the expansion and contraction range in a pile dividing manner; S4 adjusting a drilling belt according to the expansion and contraction average value; S5 taking a standard value as an actual target drilling distance, and performing wire compensation equidistant target drilling; S6 dividing the boards into different piles, and transferringthe boards to a board edge routing process; S7 routing different number of V-shaped grooves in the board edges; S8 treating the expansion and contraction boards in a pile dividing manner; S9 manufacturing one standard board drilled target; S10 measuring an accuracy error by each target drilling machine per shift every day according to the standard board. According to the method, X-RAY and drillingparameters are strictly controlled, the target drilling machines measure accuracy by the aid of the standard board every day, so that the accuracy of the target drilling machines is within a controllable range, and borehole deviation caused by accuracy misalignment of the target drilling machines is prevented.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a method for improving drilling deviation of multilayer boards. Background technique [0002] At present, the design of printed circuit boards tends to be more and more high-density, which brings many challenges to the manufacture of printed circuit boards, and the difficulty of production is increasing. In the production of PCB multilayer boards, the scrap rate remains high, especially the internal short scrap accounts for a high proportion of various scraps, which brings great pressure to the quality control of multilayer boards, and the scrapping cost of multilayer boards cannot be ignored. Therefore, how to reduce the scrapping rate of the inner layer short circuit is a common concern in the industry. If we want to improve quality, reduce cost, and create higher profits, we must first reduce short-term scrapping. One of the main reasons for the scrapping of internal ...

AI Technical Summary

Problems solved by technology

One of the main reasons for the scrapping of internal short circuit boards is that during the X-RAY target drilling process, layer deviation occurs due to different expansion and contraction values ​​of the boards, resulting in drilling deviation. How to ensure the accuracy of X-RAY drilling targets is to reduce the scrapping of internal shorts focus