Particle capturing and releasing device based on bulk acoustic wave excitation and moving bubbles

A technology for releasing devices and air bubbles, which is applied in the direction of machines/engines, liquid variable displacement machines, chemical instruments and methods, etc. It can solve the problems of complex manufacturing process, particle damage, and large volume, and achieve short response time and low production cost. , the effect of easy integration

Active Publication Date: 2018-01-16
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of generating bubbles by electrolysis and using electrowetting to move bubbles is complicated to manufacture, and the trapping device using laser is bulky, expensive, and will cause damage to particles.

Method used

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  • Particle capturing and releasing device based on bulk acoustic wave excitation and moving bubbles
  • Particle capturing and releasing device based on bulk acoustic wave excitation and moving bubbles
  • Particle capturing and releasing device based on bulk acoustic wave excitation and moving bubbles

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Embodiment Construction

[0055] The microfluidic upper chip 1 in the present invention adopts SU-8 type negative photoresist to make a positive mold, and polydimethylsiloxane (PDMS) injection molding process is used for manufacturing. The specific process flow is as follows:

[0056] (a) with Figure 13 , select the silicon substrate I22 as the substrate, wash it with deionized water, and dry it on a rubber drying table at a temperature of 110°C;

[0057] (b) with Figure 14 , spin-coat a layer of SU-8 glue 23 on the silicon substrate I22, the thickness of the glue layer is 50μm-100μm, use the glue drying table for pre-baking, first at a temperature of 65°C for 35min, and then at a temperature of 95°C The drying time is 30-90min (related to the thickness of the adhesive layer, the greater the thickness, the longer the drying time), then naturally cool to solidify the SU-8 adhesive 23, which is a negative photoresist;

[0058] (c) with Figure 15 , place the mask plate 24 on the surface of the cured...

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Abstract

The invention discloses a particle capturing and releasing device based on bulk acoustic wave excitation and moving bubbles. The particle capturing and releasing device based on bulk acoustic wave excitation and moving bubbles can be used in fields such as life engineering, medical science, micro assembly, and chemical analysis, and comprises a micro-fluidic upper chip, a PDMS membrane, a piezoelectric actuator, a glass substrate, and a magnet exciting coil; the micro-fluidic upper chip is provided with a liquid inlet, a main runner, a side runner, and a liquid outlet; when particles are captured by bubbles successively, the particles are stored in the side runner, and are released back into the main runner based on requirements. The particle capturing and releasing device is prepared viamicro machining, bulk acoustic wave generated by the piezoelectric actuator is capable of exciting bubbles in the runners to perform radial vibration, and radial vibration of the bubbles is capable ofacoustic radiation force on nearby particles, so that particle capturing is realized. Expansion of the volume of paraffin is capable of providing the PDMS membrane with force so as to realize deformation of the PDMS membrane, the pressure in the side runner is changed, the positions of the bubbles carrying the particles in the side runner are controlled, and particle moving is realized.

Description

technical field [0001] The present invention is a particle capture and release device based on bulk acoustic wave excitation and moving bubbles. Vibrating bubbles under bulk acoustic wave excitation can capture particles. Particles in the main channel are separated, or the liquid in the main channel is renewed and replaced, and then the particles are released from the side channel back into the main channel. The capture, movement and release of particles is the key technology in micromanipulation, and has important research value in many scientific fields such as life engineering, medicine, microassembly, and chemical analysis. Background technique [0002] In recent years, there has been an increasing demand for non-contact manipulation of tiny objects in the fields of biomedicine and industry, and the use of sound waves to manipulate particles is one of the hotspots of recent research. In 2008, Sang Kug Chung proposed a method of manipulating micro-scale objects using bul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01L3/00F04B43/02
Inventor 刘本东田宝华杨旭李默涵杨佳慧李德胜
Owner BEIJING UNIV OF TECH
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