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Adhesive composition for reclosable multi-layer film

A technology of composition and tackifier, applied in the direction of film/sheet adhesive, adhesive, application, etc., can solve problems such as difficult processing

Inactive Publication Date: 2018-01-19
DOW GLOBAL TECH LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Styrenic block copolymer (SBC) based hot melt adhesives eliminate some processing steps but are difficult to process and not approved for direct food contact

Method used

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  • Adhesive composition for reclosable multi-layer film
  • Adhesive composition for reclosable multi-layer film
  • Adhesive composition for reclosable multi-layer film

Examples

Experimental program
Comparison scheme
Effect test

example

[0157] 1. Materials

[0158] Materials used in the examples are provided in Table 1 below.

[0159] Table 1

[0160]

[0161] 2. Sample Preparation

[0162] Adhesive formulations were prepared using a twin-screw extruder and then tested for melt index and density (Table 2). The formulations shown in Table 2 were prepared by a single-step twin-screw extrusion process. The formulation components are listed in Table 2 in wt%. The compounding operation was performed on a COPERION ZSK-25 25mm co-rotating twin-screw extruder. The overall length to diameter ratio (L / D) of the extruder was 48. The extruder was equipped with a 24kW electric motor and a maximum screw speed of 1200rpm. The feed system for this extrusion line consists of two loss-in-weight feeders. The polymer precursor was fed into the main feed inlet of the extruder using a K-Tron KCLQX3 single screw feeder. The PICCOTAC tackifier was fed into the side arm at barrel 5. HYDROBRITE 550 process oil was added th...

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Abstract

The disclosure provides a composition. In an embodiment, the composition includes: A) an ethylene / alpha-olefin multi-block copolymer having a melt index from 0.2 g / 10 min to 8.0 g / 10 min; B) a styrenic block polymer comprising from greater than 1 wt% to less that 50 wt% units of polymerized styrene; C) a tackifier; D) an oil; and the composition has a melt index from 3 g / 10 min to 50 g / 10 min. Thecomposition is suitable for use as a pressure sensitive adhesive layer in a reclosable packaging structure.

Description

Background technique [0001] The need for convenience features is a growing trend in the food packaging industry, with consumers seeking packages that are easy to handle and use. The reclosability of packaging not only provides convenience to the consumer, but also enables longer shelf life of the packaged product without the need to transfer the contents to a separate reclosable package such as a food storage bag, Ziploc bag. [0002] The reclosable packaging structure is achieved by designing the multilayer structure in such a way that the interface strength between the sealant layer and an adjacent delamination layer having adhesive functionality is lower than the strength between the sealant layer and the film structure. When the multilayer film is pulled from the container, the sealant layer ruptures and detaches from the adjacent release layer. Sealant residue is deposited on the container surface and the surface of the release layer is exposed. When a pressure sensitiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/00C08L53/00C08L53/02B32B27/30B32B27/32
CPCB32B27/302B32B27/32C09J153/00C08L53/00C08L2203/162C08L2205/02B32B2405/00B32B7/12B32B27/06B32B27/28B32B27/30B32B2439/70C08L53/02C09J7/387C08L23/0815C08L25/10
Inventor 吴晓松D·W·希默尔格吉尔L·J·肖邦三世
Owner DOW GLOBAL TECH LLC