Component mounting system, component mounting machine, and component mounting method
An installation system and installation machine technology, which is used in the direction of assembling printed circuits, electrical components, and electrical components with electrical components, which can solve the problems that components cannot be adhered to the substrate and the viscosity of the adhesive changes, and achieve the effect of suppressing waste.
Active Publication Date: 2019-10-22
YAMAHA MOTOR CO LTD
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Problems solved by technology
In this type of bonding apparatus, if a long time elapses after the adhesive is applied to the substrate, the viscosity of the adhesive will change, and the component may not be properly bonded to the substrate.
Method used
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Embodiment Construction
[0033] figure 1 is a block diagram showing an example of the component mounting system of the present invention. The component mounting system 1 includes a control device 2 , a substrate conveyance unit 3 , a coater 4 , and two component mounting machines 5 . The coater 4 and the two component mounting machines 5 are arranged in a row along the X direction, and the substrate conveyance section 3 conveys the flat substrate S along the X direction ( Figure 5 ), thereby sequentially loading the substrate S into the coater 4 and the two component mounting machines 5 . In addition, in order to distinguish between the two component mounting machines 5 , the component mounting machine 5 on the upstream side in the X direction is appropriately assigned a reference numeral 5A, and the component mounting machine 5 on the downstream side in the X direction is appropriately assigned a reference numeral 5B.
[0034] Then, the coater 4 applies an adhesive to the substrate S carried in, a...
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Whether to allow the start of the mounting process for the plurality of application locations (P) is determined based on the elapsed post-application time (Tp) after the adhesive is applied to the application locations (P). That is, for each application site (P), it is predicted whether or not the elapsed time (Tp) after application exceeds the limit time (Tl) at the mounting time (Tm) at which the component is mounted in the mounting process. And, when there is no coating site (P) in which the elapsed time (Tp) after coating at the mounting time (Tm) exceeds the limit time (T1) among the plurality of coating sites (P), the mounting process is allowed to start. On the other hand, in the case where there is a coating site (P) in which the elapsed time (Tp) after coating at the mounting time (Tm) exceeds the limit time (T1) among the plurality of coating sites (P), the start of the mounting process is prohibited. .
Description
technical field [0001] The present invention relates to a technique for mounting a component on a substrate by placing the component on a coating material such as an adhesive or solder coated on the substrate. Background technique [0002] Patent Document 1 describes a bonding apparatus for bonding a component to a substrate via an adhesive applied on the substrate. In such a bonding apparatus, if a long time elapses after the adhesive is applied to the substrate, the viscosity of the adhesive may change, and the element may not be properly bonded to the substrate. Therefore, in Patent Document 1, the elapsed time after the adhesive is applied to the substrate is measured in parallel with the bonding operation, and the bonding operation is stopped when the elapsed time exceeds a predetermined time. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Laid-Open No. 10-321653 Contents of the invention [0006] Th...
Claims
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IPC IPC(8): H05K13/04H05K3/34
CPCH05K3/303H05K13/0465H05K13/0469H05K13/08B23K2101/42B23K1/0016H05K13/0408
Inventor 松下大辅春日大介
Owner YAMAHA MOTOR CO LTD