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Packaging method and packaging structure of OLED panel

A packaging method and packaging structure technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of poor structure, poor water and oxygen barrier performance, and inability to block water and oxygen, so as to prevent water and oxygen intrusion and packaging. good effect

Active Publication Date: 2018-01-23
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

However, since the frame glue is generally made of organic matter, even after curing, its structure is still not tight, and it does not have a good effect of blocking water and oxygen. At the same time, although the hygroscopic agent can absorb water vapor, it only delays the intrusion of water vapor into the OLED device. It does not fundamentally prevent the intrusion of water and oxygen, which makes the water and oxygen barrier performance of this packaging structure poor

Method used

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  • Packaging method and packaging structure of OLED panel
  • Packaging method and packaging structure of OLED panel
  • Packaging method and packaging structure of OLED panel

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Embodiment Construction

[0040] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0041] see figure 1 , the present invention provides a method for encapsulating an OLED panel, comprising the following steps:

[0042] Step S1, please refer to figure 2 , providing a package cover 200 .

[0043] Specifically, the material of the packaging cover plate 200 is glass.

[0044] Step S2, please refer to figure 2 , coating a ring of sealant 300 on the package cover 200 .

[0045] Specifically, the sealant 300 is a sealant of organic materials commonly used in the prior art.

[0046] Specifically, in the step S2, the sealant 300 is coated through a nozzle.

[0047] Further, in the step S2, the glue frame 300 is coated by a multi-dispenser.

[0048] Step S3, please refer to image 3 On the packaging cover 200, a circle of li...

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Abstract

The invention provides a packaging method and a packaging structure of an OLED panel. According to the packaging method of the OLED panel, a circle of liquid metal is arranged inside frame rubber on apackaging cover plate, the packaging cover plate and a TFT substrate are laminated in a vacuum manner so as to obtain the packaging structure, then when external water and oxygen penetrate the framerubber made of an organic material and enter the packaging structure, liquid metal reacts with entering oxygen so as to generate a liquid metal oxidized membrane on the surface to form a compact water-oxygen resistance layer. The packaging structure can prevent water and oxygen from entering the OLED device, and has good packaging effect.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED panel packaging method and packaging structure. Background technique [0002] Organic Light Emitting Display (OLED) has self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range, and can realize flexible display and With many advantages such as large-area full-color display, it is recognized by the industry as a display device with the most potential for development. [0003] According to the driving method, OLED can be divided into two categories: passive matrix OLED (Passive Matrix OLED, PMOLED) and active matrix OLED (Active Matrix OLED, AMOLED), namely direct addressing and thin film transistor (TFT) matrix addressing. kind. Among them, AMOLED has pixels arranged in an array, belongs to the active display type, has high luminous efficiency, and is ...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8426H10K50/844H10K50/87H10K71/00H10K50/8423H10K71/164H10K71/441
Inventor 杨中国李金川
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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