Display backboard, manufacturing method thereof and display device

A technology for display backplanes and substrates, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electric solid-state devices, etc., can solve the problems that the display backplane needs to be improved, the production process of the display backplane is complicated, and the industrialization is not easy.

Active Publication Date: 2020-08-04
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after the hole is punched, it is necessary to prevent the water and oxygen intrusion of the display backplane at the punched position, which will cause the package failure, but the current manufacturing process of the display backpla

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  • Display backboard, manufacturing method thereof and display device
  • Display backboard, manufacturing method thereof and display device
  • Display backboard, manufacturing method thereof and display device

Examples

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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary, only for explaining the present invention, and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, the technique or condition described in the literature in the field or the product specification is used.

[0029] In one aspect of the present invention, the present invention provides a display backplane. According to an embodiment of the present invention, refer to Figure 1a and Figure 1b , the display backplane 10 includes a substrate 100, a first planarization layer 200 is provided on one side of the substrate 100, an organic light-emitting layer is provided on the side of the first planarization layer 200 away from the substrate 100, and the The display back panel 10 is divided into a pixel area A, a partition area B, and a punched area C, the partition area B is arranged arou...

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Abstract

The invention provides a display backboard, a manufacturing method thereof and a display device. The display backboard comprises a substrate, a first planarization layer is arranged on one side of thesubstrate, an organic light-emitting layer is arranged on the side, away from the substrate, of the first planarization layer, the display backboard is divided into a pixel area, a partition area anda punching area, the partition area is arranged around the punching area, and the pixel region is arranged around the partition region; and in the partition area, at least one annular water-oxygen barrier layer arranged around the punching area is arranged on a part of the surface, far away from the substrate, of the first planarization layer, and the annular water-oxygen barrier layer is used for forming an interval in the organic light-emitting layer in the partition area such that the organic light-emitting layer in the partition area is discontinuous in the direction that the pixel area faces the punching area. The display backboard is simple in manufacturing process, low in cost, easy to industrialize, capable of effectively preventing water and oxygen invasion and good in reliability.

Description

technical field [0001] The present invention relates to the field of display technology, and in particular, to a display backplane, a manufacturing method thereof, and a display device. Background technique [0002] With the advancement of science and technology, in display technology, people have higher and higher requirements for visual experience, and the screen ratio of display devices is particularly important. In flexible display technology, the punched screen is a new type of flexible display screen that replaces the notch screen and the water drop screen and achieves a higher screen ratio of AMOLED. The ratio is further improved, and it is also more beautiful. However, after punching, it is necessary to prevent the intrusion of water and oxygen at the punched position of the display backplane, resulting in package failure. However, the current production process of the display backplane that can prevent the packaging failure after punching is complicated. , difficu...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32H01L21/77
CPCH10K59/124H10K50/844H10K59/1201
Inventor 张则瑞樊浩原李易峰王子峰闫鑫坤
Owner BOE TECH GRP CO LTD
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