Organic light emitting diode packaging structure, packaging method, and display device

A technology of light-emitting diodes and packaging structures, applied in the direction of organic semiconductor devices, semiconductor devices, electrical components, etc., can solve the problems of affecting efficiency, wasting materials, increasing the difficulty of evaporation process of organic light-emitting materials, etc., and achieve the effect of increasing conductivity

Active Publication Date: 2017-03-01
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the non-pixel area, a number of cathode auxiliary lines are arranged on one side of the gate line, signal line and power line, which will lead to a low aperture ratio of the entire display device.
For arranging a number of cathode auxiliary lines on one side of the gate lines, signal lines and power lines, all organic materials need to be evaporated with a fine metal mask (Fine Metal Mask, referred to as FMM) during the evaporation process of organic light-emitting materials. Plating, which increases the difficulty of the evaporation process of organic light-emitting materials, affects efficiency, wastes materials, and brings great difficulties to AMOLED preparation.

Method used

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  • Organic light emitting diode packaging structure, packaging method, and display device
  • Organic light emitting diode packaging structure, packaging method, and display device
  • Organic light emitting diode packaging structure, packaging method, and display device

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Embodiment Construction

[0028] The specific embodiments of the invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0029] Inorganic films are mainly water and oxygen barrier layers, but they have low elasticity and large internal stress, so flexible packaging cannot be realized. Organic polymers have high elasticity, which can inhibit the cracking of inorganic films and release the stress between inorganic substances. The combination of the two can achieve A flexible packaging method.

[0030] The organic light emitting diode packaging structure in the embodiment of the present invention is based on the above flexible packaging method to realize flexible packaging.

[0031] figure 1 It shows a schematic structural diagram of an organic light emitting diode packaging structure provided b...

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Abstract

The invention discloses an organic light emitting diode packaging structure, a packaging method, and a display device. The packaging structure includes: an organic light emitting diode display area arranged on a substrate, a cathode pattern arranged on the display region, and a first cathode pattern arranged on the cathode pattern. Inorganic barrier layer, an organic buffer layer located on the first inorganic barrier layer, the edge of the organic buffer layer is electrically connected to the cathode pattern in the edge area of ​​the display area; the second inorganic barrier layer, the edge of the second inorganic barrier layer is in the The edge area of ​​the display area is directly connected to the substrate to cover other layers. In this structure, since the organic buffer layer is conductive and transparent, and the edge of the organic buffer layer is electrically connected to the cathode pattern in the edge region of the display area, while increasing the conductivity of the cathode pattern, it does not affect the transmittance of the package. In this way, the IR drop can be reduced while ensuring a simple packaging process and not affecting the aperture ratio of the display device.

Description

technical field [0001] The invention relates to the field of organic light emitting diode display, in particular to an organic light emitting diode packaging structure and packaging method, and a display device. Background technique [0002] For a top-emitting active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode, referred to as AMOLED) display device, the cathode is generally formed of a conductive metal, such as Mg, Ag and other conductive metals, and is covered in one piece on the array substrate. Due to the high transparency of the cathode is required for the bulk electrode, the cathode is usually very thin and the resistance is high. The cathode resistance is very high, which will increase the IR drop (resistance voltage drop). Excessive IR drop will affect the uniformity of the picture. [0003] In the existing solutions, auxiliary cathode lines are used to reduce IR drop, usually in the non-pixel area on the array substrate, forming s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/54H01L51/56
CPCH10K50/8445H10K2102/3026H10K50/80H10K50/82H10K71/00H10K71/60H10K2102/101H10K2102/103
Inventor 高静张嵩
Owner BOE TECH GRP CO LTD
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