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Adhesive, preparation method thereof, adhesive tape and preparation method thereof

An adhesive and adhesive layer technology, applied in the direction of adhesives, adhesive additives, other rubber adhesives, etc., can solve the problems of reducing the quality of signal transmission, and achieve the advantages of shielding external interference, low production cost, and reducing interference. Effect

Inactive Publication Date: 2018-01-26
SHENZHEN MEIXIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process of radio frequency signal transmission in the line will be weakened by external magnetic field interference, reducing the quality of signal transmission

Method used

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  • Adhesive, preparation method thereof, adhesive tape and preparation method thereof

Examples

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preparation example Construction

[0063] The present invention also provides a method for preparing an adhesive, wherein the adhesive is the above-mentioned adhesive; the preparation method comprises the following steps:

[0064] S10: Add 0.5-2 parts of surface treatment agent to 3-9 parts of solvent and stir to dissolve in the solvent;

[0065] S20: adding 5 to 30 parts of radio-frequency optimized functional materials into the solution obtained in S10 and stirring;

[0066] S30: continue to add 10-20 parts of oligomers and 50-80 parts of high polymers to the solution obtained in S20 and stir;

[0067] S40: adding 3-10 parts of a crosslinking agent into the solution obtained in S30 and stirring to obtain an adhesive.

[0068] It should be noted that, in the above step S30, it may be: first add the oligomer to the solution obtained in S20 and stir, and then continue to add the high polymer and stir; it may also be: first add the high polymer to S20 to obtain solution and stirred, then continue to add oligome...

Embodiment 1

[0090] Step 1: apply the above-mentioned adhesive on the peeling surface of the second release film 300, and then put it into an oven with a temperature of 80° C. to bake to form the adhesive layer 200; the preparation method of the adhesive is as follows:

[0091] S10: Add 3 parts of solvent into a polyester bottle, add 0.5 part of surface treatment agent into the solvent and stir to dissolve in the solvent;

[0092] S20: Add 5 parts of radio-frequency optimized functional materials to the solution obtained in S10, and stir with a high-speed stirrer at a stirring speed of 900 r / min for 10 min;

[0093] S30: Add 10 parts by weight of oligomers to the solution obtained in S10, and stir for 10 minutes with a high-speed stirrer at a stirring speed of 900 r / min;

[0094] S40: Add the solution obtained in S30 to 50 parts of high polymer, and stir with a high-speed mixer at a stirring speed of 900r / min for 10min;

[0095] S50: Add 3 parts of cross-linking agent into the solution ob...

Embodiment 2

[0098] Step 1: apply the above-mentioned adhesive on the peeling surface of the second peeling film 300, and then put it into an oven with a temperature of 100° C. to bake to form the adhesive layer 200; the preparation method of the adhesive is as follows:

[0099] S10: Add 5 parts of solvent into a polyester bottle, add 0.8 part of surface treatment agent into the solvent and stir to dissolve in the solvent;

[0100] S20: Add 10 parts of radio-frequency optimized functional materials to the solution obtained in S10, and stir with a high-speed stirrer at a stirring speed of 1000 r / min for 9 minutes;

[0101] S30: Add 12 parts of oligomers to the solution obtained in S10, and use a high-speed stirrer to stir for 9 minutes at a stirring speed of 1000 r / min;

[0102] S40: Add the solution obtained in S30 to 55 parts of high polymer, and stir with a high-speed mixer at a stirring speed of 1000r / min for 9 minutes;

[0103] S50: Add 5 parts of cross-linking agent to the solution o...

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Abstract

The invention discloses an adhesive, a preparation method thereof, an adhesive tape and the preparation method thereof. The adhesive is prepared in the manner of mixing and crosslinking the raw materials in parts by weight as follows: 50-80 parts of high polymer, 10-20 parts of oligomer, 5-30 parts of radio frequency optimized functional material, 0.5-2 parts of surface treating agent, 3-10 partsof crosslinking agent and 3-9 parts of solvent. According to the invention, a material for enhancing the insulating and shielding functions of the adhesive is added into the adhesive; the prepared adhesive tape is capable of effectively shielding the external interference; when the adhesive tape is applied to a shielding layer of an inner circuit in an electronic product, the interference is further reduced, the signal attenuation is reduced and the stability of the radio frequency wire harness in the channel is guaranteed so that the radio frequency signal transmission is optimized.

Description

technical field [0001] The invention relates to the technical field of materials for optimizing radio frequency signal transmission, in particular to an adhesive and a preparation method thereof, an adhesive tape and a preparation method thereof. Background technique [0002] At present, electronic products have become an indispensable part of our life, and they are increasingly developing in the direction of lightweight and intelligent. Under this background, the stable and high-quality transmission of radio frequency signals in electronic products is particularly important. The process of radio frequency signal transmission in the line will be weakened by external magnetic field interference, reducing the quality of signal transmission. Contents of the invention [0003] The inventors found that by applying the adhesive with insulating and shielding function to the shielding layer of the internal circuit of the electronic product, the stability of the radio frequency ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/04C09J121/00C09J183/04C09J11/04C09J11/06C09J11/08C09J7/10C09J7/40C09J7/30
Inventor 陆兰硕林学好
Owner SHENZHEN MEIXIN ELECTRONICS