A kind of air bath device and its control method and application
A gas supply device and gas bath technology, applied in the field of lithography machines, can solve the problems of poor stability and uniformity of the temperature and pressure of the gas bath, and the drift of gas temperature from the exposure center, so as to reduce the difficulty of control and improve the stability and uniformity properties, thickness and size reduction
Active Publication Date: 2019-04-12
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
[0005] The present invention provides an air bath device, a control method and its application to solve the problems existing in the prior art that the exit position of the end of the air bath is far from the exposure center and that the temperature-controlled gas is prone to temperature drift due to external influences. Poor stability and uniformity of air bath temperature and pressure
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[0035] The present invention is described in detail below in conjunction with accompanying drawing:
[0036] Such as Figure 3-8As shown, the present invention provides an air bath device, comprising an air supply device 1, a cooling water supply device 2 and an air bath terminal device 3, and a pressure regulating device 4 is arranged between the gas supply device 1 and the air bath terminal device 3, so that A temperature adjustment device 5 is provided between the cooling water supply device 2 and the air bath terminal device 3, and the air bath terminal device 3 is provided with an air channel 31 and a water channel 32, and the entrance of the air channel 31 Connected to the pressure regulating device 4, the gas outlet of the gas channel 31 is close to the water channel 32 and communicates with the working surface 33 of the air bath terminal device 3 (that is, the side corresponding to the object 6 to be air bathed); The inlet of the water channel 32 is connected to the o...
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The invention discloses an air bath device and a control method and application. The device comprises an air supply device, a cooling water supply device and an air bath terminal device; a pressure adjusting device is arranged between the air supply device and the air bath terminal device; a temperature adjusting device is arranged between the cooling water supply device and the air bath terminaldevice; an air way channel and a water way channel are arranged in the air bath terminal device; an inlet of the air way channel is connected with the pressure adjusting device; an air way outlet of the air way channel is near the water way channel, and communicates with a working surface of the air bath terminal device; an inlet of the water way channel is connected with an outlet of the temperature adjusting device, and an outlet of the water way channel is connected with an inlet of the cooling water supply device; and apertures of the air way channel and the water way channel are both smaller than 0.1 mm. Closed-loop control is realized through the pressure adjusting device and the temperature adjusting device; and through the air way channel and the water way channel in a micro-runnerform, and heat exchange is performed in the air bath terminal device, the air bath temperature, the pressure uniformity and the stability are improved.
Description
technical field [0001] The invention relates to the field of photolithography machines, in particular to an air bath device, a control method and an application. Background technique [0002] The traditional air bath control method generally uses normal pressure air supply. In order to ensure the pressure stability and uniformity of the air bath outlet, a static pressure chamber structure 101 is usually installed in the air bath terminal device and a filter or filter cloth 102 is installed to carry out the air bath. Filtration pressurization, while adopting grille or louver structure 103 at the outlet for air bath guidance, such as figure 1 shown. In order to stabilize the pressure difference between the outlet and inlet of the air bath end, it is necessary to ensure that the thickness of the static pressure chamber reaches a certain size, and the thickness of the filter, grille or louver is added, resulting in a large overall thickness of the air bath end device. [0003]...
Claims
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IPC IPC(8): F17D1/02F17D3/01G03F7/20
CPCF17D1/02F17D3/01G03F7/70
Inventor 郎东春杨志斌
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD