Circuit board with thick-copper line and manufacturing method thereof

Abstract

The present invention provides a manufacturing method of a circuit board with a thick-copper line. The method comprises the following steps: providing a copper-clad board, wherein the copper-clad board comprises an insulation layer and a first copper foil layer formed at one of the surfaces of the insulation layer; forming a photosensitive film at the surface of the first copper foil layer; forming a plurality of openings in the photosensitive film, wherein the first copper foil layer is exposed through the openings; performing first etching of the first copper foil layer starting from the positions of the openings, and obtaining a first conduction circuit pattern, wherein the first conduction circuit pattern comprises a plurality of connected trapezoids and first opening portions formed between adjacent trapezoids, and each first opening portion comprises two side walls and a bottom walls connecting with the two side walls; forming a protective layer at the surface of each side wall;performing secondary etching of the first copper foil layer starting from the position of the bottom wall, and forming a second conduction circuit pattern; and removing a dry film, wherein the first conduction circuit pattern and the second conduction circuit pattern commonly form a conduction circuit layer, so that a circuit board with a thick-copper line is obtained.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with thick copper lines and a production method thereof. Background technique [0002] With the rapid development of electronic products, printed circuit boards, which are used as component supports and carriers for transmitting electrical signals, should also gradually become miniaturized, lightweight, high-density and multi-functional, and then the precision and thick copper lines of printed circuit boards production puts forward higher requirements. The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thicker the copper line, so there are limitations in using thick copper to make thick copper lines; and the conductive lines of conventional printed circuit boards are usually It is a subtractive method, but limited by the thickness of copper, thick co...

AI Technical Summary

Problems solved by technology

The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thicker the copper line, so there are limitations in using thick copper to make thick copper lines; and the conductive lines of conventional printed circuit boards are usually It is a subtractive method, but limited by the thickness of copper, thick copper lines can only be matched with thin copper, and after production, the etching factor is poor, and the etching is not clean to form burrs; solder resist ink is difficult to fill, and it is easy to produce bubbles and other problems

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