Precise laser cutting machine for thin flexible board and cutting method

Abstract

The invention discloses a precise laser cutting machine for a thin flexible board and a cutting method. The precise laser cutting machine comprises a control system, a vacuum absorbing positioning platform, an XYZ-axis transmission system, a laser cutting system and a CCD positioning system, wherein the vacuum absorbing positioning platform, the XYZ-axis transmission system, the laser cutting system and the CCD positioning system are electrically connected to the control system; the laser cutting system is used for performing laser cutting on the thin flexible board; the CCD positioning systemis used for shooting images of a plurality of position points of the thin flexible board and transmitting to the control system; the control system is used for comparing the images of the position points of the thin flexible board with the image of a standard position point and then determining the error value; the XYZ-axis transmission system is controlled through the control system to compensate the error value during laser cutting. With the adoption of the machine, the distance from a laser cutting device to a product can be adjusted; the product can be absorbed and fixed through vacuum; the positioning error can be determined by CCD positioning; and moreover, the positioning error value can be compensated in X, Y and Z directions.

Description

technical field [0001] The invention relates to the technical field of laser cutting equipment, in particular to a thin flexible plate laser precision cutting machine and a cutting method. Background technique [0002] At present, cutting equipment for thin flexible boards (such as flexible circuit boards) mainly uses contact means such as mechanical knives to realize cutting of thin flexible boards. On the one hand, due to the need to subject the thin flexible sheet to a certain cutting force when using contact cutting, it is easy to cause cutting deviation, and at the same time, it is easy to increase the clamping force on the thin flexible sheet, which is easy to damage the thin flexible sheet, and the scrap rate On the other hand, mechanical tool cutting will also cause cutting powder on the substrate, which requires additional processing, which not only increases the production process, reduces production efficiency, but also increases production costs. On the other ha...

AI Technical Summary

Problems solved by technology

[0004] First, the loading and unloading mechanism, working platform, laser cutting device and other components of the laser cutting machine are only suitable for cutting hard PCB boards, but for thin flexible boards (such as flexible circuit boards), laser cutting is difficult;

[0005] Second, the loading, positioning and clamping device of the laser cutting machine can only move in the horizontal direction and in the front and rear directions, and cannot move in the up and down direction. During the cutting process, the laser cutting device cannot adjust the distance between the laser cutting device and the PCB board

[0006] Third, the laser cutting machine is not equipped with a CCD positioning device. After the PCB board is positioned by the suction cup, there is often a positioning error, which leads to the cutting accuracy of the laser cutting machine cannot be guaranteed

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