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Chip parameter yield prediction method considering multiple property constraints at same time

A prediction method and yield rate technology, applied in the fields of electrical digital data processing, special data processing applications, instruments, etc.

Inactive Publication Date: 2018-03-06
NANJING UNIV OF POSTS & TELECOMM
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Problems solved by technology

This method considers the accurate prediction of the yield of chip parameters under the simultaneous action of multiple performance constraints, so as to solve the problem that in the process of computer-aided design, chip designers can consider the strong correlation between various chip performance indicators, and the disturbance of design parameters Accurately predict the yield of chip parameters affected by randomness

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  • Chip parameter yield prediction method considering multiple property constraints at same time
  • Chip parameter yield prediction method considering multiple property constraints at same time
  • Chip parameter yield prediction method considering multiple property constraints at same time

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Embodiment Construction

[0034] The invention will be described in further detail below in conjunction with the accompanying drawings.

[0035] Such as figure 1 As shown, the present invention provides a method for accurately predicting chip parameter yields while considering multiple performance constraints, the method comprising the following steps:

[0036] In the process of chip design, it is necessary to consider the strong correlation between chip performance indicators caused by random disturbance of design parameters, so as to improve the accuracy of parameter yield prediction results. The method of the present invention proposes a method for accurately predicting the yield of chip parameters that can be constrained by multiple Xing En at the same time, including the following steps:

[0037] Step s101: chip performance simulation sampling. According to the design requirements of the chip, determine the type of chip performance constraints that need to be considered at the same time (f 1 ,....

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Abstract

The invention discloses a chip parameter yield prediction method considering multiple property constraints at the same time, and belongs to the technical field of multi-element parameter yield prediction under the condition that chip design parameter perturbation has random correlation. Current chip parameter yield research is mainly restricted to predicting single property index yield or carryingout balanced optimization on a plurality of single-property index yields. Aiming at the problem that above method cannot consider correlation between multiple property indexes so that parameter yieldloss is easy to cause, the invention discloses an accurate chip multi-element yield prediction method considering multiple property constraint index influences at the same time. The method specifically comprises the following steps of: firstly, considering correlation between design parameter perturbations and constructing a chip property statistic model; secondly, solving an edge distribution probability of each chip property by utilizing a saddle point line sampling method; and finally, selecting an optimum Copula function by utilizing a Copula theory so as to accurately predict a chip parameter yield considering multiple property constraints at the same time.

Description

technical field [0001] The invention relates to a method for accurately predicting the yield of chip parameters aimed at randomness of design parameter disturbance, and belongs to the technical field of computer-aided design. Background technique [0002] At the current level of chip manufacturing technology, the deviation of chip performance from the design index caused by the disturbance of design parameters will lead to a significant decline in the yield of chip parameters. In particular, since design parameter disturbances usually act on different chip performance indexes at the same time, there will be a strong correlation between chip performance indexes. Therefore, it is very important to accurately predict the yield of chip parameters by considering the impact of multiple chip performance indicators at the same time. [0003] So far, most of the known chip yield prediction methods are limited to the yield prediction for a single performance constraint index, while i...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/20
Inventor 李鑫张登银丁飞殷俊
Owner NANJING UNIV OF POSTS & TELECOMM
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