Full-automatic die bonder

A crystal-bonding machine, fully automatic technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low production efficiency, hinder production process, unfavorable industrialized large-scale production, etc., to improve productivity and improve intelligence The effect of streamlining operations and reducing labor force

Active Publication Date: 2018-03-09
厦门市迅光电子有限公司
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the working process of LED crystal bonding, in the prior art, a plurality of splints are installed on the mold, and through manual arrangement, the LED legs are vertically fixed between the adjacent clips, so that the splints can clamp the LED bracket, Realize the function of arranging and fixing the LED legs individually on the templat

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full-automatic die bonder
  • Full-automatic die bonder
  • Full-automatic die bonder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] refer to Figure 1 to Figure 7 Further explain the fully automatic crystal bonder.

[0036] A fully automatic crystal bonder, such as figure 1 As shown, it includes three modules: an automatic feeding push and clamping device, a dispensing module 1 and an automatic receiving device; specifically includes a frame 2, a mounting frame 31 arranged on the frame 2, and a mounting frame 31 arranged on the mounting frame 31. The loading rack 32 for typesetting LED legs and the receiving rack 33 for receiving materials are arranged between the mounting frame 31 and the frame 2 for driving the mounting frame 31 to reciprocate horizontally on the frame 2 The moving transverse driving mechanism 34, the placing frame 36 arranged on the mounting frame 31, the longitudinal driving mechanism 35 arranged between the horizontal driving mechanism 34 and the mounting frame 31 for driving the placing frame 36 to reciprocate longitudinally on the mounting frame 31, The clamping mechanism 4 a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a full-automatic die bonde, comprising a frame, a dispensing module group disposed on the frame, a mounting rack disposed on the frame, a material feeding load plugging rack and a material recovering load plugging rack which are disposed on the mounting rack, a material clamping mechanism disposed below the dispensing module group, a material charging push mechanism which is disposed between the material clamping mechanism and the material feeding load plugging rack and used for conveying LEG legs to the material clamping mechanism, and a material recovering mechanism used for pushing the LED legs after die bond to the material recovering load plugging rack. The material feeding load plugging rack and the material recovering load plugging rack are respectively disposed at two sides of the material clamping mechanism. The invention is advantageous in that through the cycling of automatic material feeding, material distributing, and material recovering, the processing production integrating rapidness, high efficiency, and intelligence into one piece can be realized; the intelligent operation of die bond process of LED legs can be enhanced; labor force can be reduced, and productivity can be raised.

Description

technical field [0001] The invention relates to the technical field of LED production and manufacturing equipment, more specifically, it relates to a fully automatic crystal bonding machine. Background technique [0002] In the packaging process of semiconductor devices such as IC and LED, etc., die bonding is an extremely important link; LED die bonding machine is a model specially designed for LED product bonding, which is controlled by a computer and equipped with a CCD image sensor system. The CCD system scans to determine the correct path, then enters the set programming program, and easily presses the button to realize the entire workflow; the process of die bonding is: first, the feeding system transports the die bonding bracket in the storage device to the feeder. Then the die-bonding bracket moves along the feeding channel and stays at a certain position. At this time, the dispensing module on the frame automatically points the adhesive material, that is, sticks on ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67H01L33/48
CPCH01L21/67121H01L33/48H01L2933/0033
Inventor 高美法朱剑辉
Owner 厦门市迅光电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap