Wiring circuit substrate and its manufacturing method
A technology for wiring circuit substrates and branch lines, which is applied in the field of wiring circuit substrates and its manufacturing, and can solve problems such as the decrease of proximity effect
Active Publication Date: 2022-04-22
NITTO DENKO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Therefore, the proximity effect between the first wiring pattern to the fourth wiring pattern is reduced
Method used
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no. 2 Embodiment approach
[0144] Regarding the suspension board according to the second embodiment, differences from the suspension board 1 according to the first embodiment will be described. Figure 16 , Figure 17 as well as Figure 18 It is a partially enlarged plan view of the suspension board according to the second embodiment. Figure 16 equivalent to image 3 The A-A line sectional view, Figure 17 equivalent to image 3 The B-B line sectional view, Figure 18 equivalent to image 3 C-C line sectional view.
[0145] Such as Figure 16 and Figure 17 As shown, in the suspension board 1 according to this embodiment, the power supply wiring patterns P1 and P2 are not formed on the first insulating layer 41 . Additionally, if Figure 16 ~ Figure 18 As shown, the first insulating layer 41 does not have the thin portion 41A and the thick portion 41B, but is formed to have a uniform thickness.
[0146] As in the first embodiment, the portion where the write wiring traces W1, W2 overlap the su...
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Abstract
The present invention provides a wired circuit board and a manufacturing method thereof. In the suspension board, the first insulating layer is formed on the support board. A ground layer and a wiring pattern for power supply are formed on the first insulating layer. The ground layer has an electrical conductivity higher than that of the supporting substrate. A second insulating layer is formed on the first insulating layer so as to cover the ground layer and the wiring pattern for power supply. A write wiring pattern is formed on the second insulating layer so as to overlap the ground layer. In the stacking direction of the support substrate, the first insulating layer, and the second insulating layer, the distance between the ground layer and the write wiring pattern is larger than the distance between the power supply wiring pattern and the write wiring pattern.
Description
technical field [0001] The present invention relates to a wired circuit board and a manufacturing method thereof. Background technique [0002] Conventionally, wired circuit boards have been used in various electric and electronic devices. Japanese Patent Application Laid-Open No. 2010-3893 describes a suspension board applied to an actuator of a hard disk drive device as a wired circuit board. [0003] In the wired circuit board disclosed in JP 2010-3893 A, the first insulating layer is formed on the suspension main body. A first wiring pattern and a second wiring pattern are formed in parallel at intervals on the first insulating layer. A second insulating layer is formed on regions on both sides of the first wiring pattern and the second wiring pattern on the first insulating layer. A third wiring pattern is formed on the second insulating layer on the side of the second wiring pattern, and a fourth wiring pattern is formed on the second insulating layer on the side of...
Claims
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IPC IPC(8): H05K1/02H05K1/05H05K3/46
CPCH05K1/0218H05K1/025H05K1/0298H05K1/05H05K3/4644H05K2201/0929H05K2201/0776G11B5/486H05K3/4685H05K2201/0187H05K2201/0191H05K2203/0514H05K1/056H05K1/0228H05K2201/0154H05K2201/093H05K1/0225H05K1/0245H05K1/053H05K1/0224H05K1/115G11B5/484H05K2201/0195H05K2201/09254H05K2201/09227H05K2201/10083H05K3/4038H05K1/09H05K1/0393H05K1/0277
Inventor 山内大辅田边浩之
Owner NITTO DENKO CORP