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A kind of packaging method of optical fingerprint sensor

A fingerprint sensor and packaging method technology, which is applied in the acquisition/organization of fingerprints/palmprints, instruments, and print image acquisition, etc. The effect of glass, thickness reduction, and light transmission improvement

Active Publication Date: 2021-11-02
BEIJING SUPERPIX MICRO TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The light transmittance of the optical fingerprint sensor becomes worse; 2. The thickness of the optical fingerprint sensor is increased

Method used

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  • A kind of packaging method of optical fingerprint sensor
  • A kind of packaging method of optical fingerprint sensor

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Experimental program
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Embodiment Construction

[0011] The embodiments of the present invention will be further described in detail below. The content not described in detail in the embodiments of the present invention belongs to the prior art known to those skilled in the art.

[0012] The packaging method of the optical fingerprint sensor of the present invention, its preferred embodiment is as follows figure 2 Shown:

[0013] A film for blocking infrared rays is directly coated on the light-receiving surface of the optical fingerprint sensor.

[0014] There is no other transparent material between the light-receiving surface of the optical fingerprint sensor and the film for blocking infrared rays.

[0015] The optical fingerprint sensor packaging method of the present invention saves glass, and directly coats the IRCUT film on the surface of the optical fingerprint sensor, thereby improving the light transmittance of the optical fingerprint sensor and reducing the thickness of the optical fingerprint sensor.

[0016...

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Abstract

The invention discloses a packaging method of an optical fingerprint sensor. A thin film for blocking infrared rays is directly coated on the light-receiving surface of the optical fingerprint sensor. The glass is omitted, and the IR CUT film is directly coated on the surface of the optical fingerprint sensor, which improves the light transmittance of the optical fingerprint sensor and reduces the thickness of the optical fingerprint sensor.

Description

technical field [0001] The invention relates to an optical fingerprint recognition technology, in particular to a packaging method of an optical fingerprint sensor. Background technique [0002] With the development of smart phones, mobile payment and other fields, information security has also received extensive attention. Internet mobile terminals have changed from traditional passwords and gesture recognition to fingerprint recognition. Optical fingerprint sensors have higher resolution than capacitive sensors and are not as vulnerable to corrosion, wear and static interference as capacitive sensors. However, when the optical fingerprint sensor is affected by ambient light, the fingerprint collection speed and accuracy will decrease; especially the optical fingerprint sensor using the traditional packaging method. [0003] In the existing technology, such as figure 1 As shown, the packaging method of the traditional optical fingerprint sensor is: paste transparent glass...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 马建斌李文杰旷章曲
Owner BEIJING SUPERPIX MICRO TECHNOLOGY CO LTD