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PCB gumming mechanism

A technology of PCB board and gluing, which is applied in the direction of coating, device for coating liquid on the surface, etc., can solve problems such as uneven coating, and achieve the effect of simple device structure and improved production yield.

Inactive Publication Date: 2018-03-23
SUZHOU YILIHUA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a PCB board gluing mechanism to solve the problem of uneven coating of the roller with bristles when coating the glue

Method used

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Examples

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Embodiment Construction

[0016] Such as figure 1 , figure 2 , image 3 As shown, a PCB board gluing mechanism includes a housing 1, a fixing strip 2, a glue storage tank 3, a lower glue nozzle 4, a side sealing plate 5, a glue suction mechanism 6, a squeegee plate 7, and a glue application cylinder 8 , the fixed strip 2 is symmetrically arranged on the upper end of the housing 1, the fixed strip 2 is connected with the housing 1 by bolts, the glue storage tank 3 is located inside the symmetrically arranged fixed strip 2, and the glue storage The tank 3 is connected to the fixing strip 2 by riveting. The lower rubber nozzle 4 is located at the lower end of the rubber storage tank 3 and extends into the inside of the housing 1. The lower rubber nozzle 4 is connected to the rubber storage tank 3 by bonding. The side sealing plate 5 is symmetrically arranged on the housing 1, the side sealing plate 5 is connected to the housing 1 by riveting, the glue suction mechanism 6 is fixedly connected to the sid...

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PUM

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Abstract

The invention discloses a PCB gumming mechanism. The PCB gumming mechanism comprises a shell, a fixed strip, a glue storing tank, a glue discharging soft nozzle, a side sealing plate, a glue sucking mechanism, a glue scraping plate and a gumming barrel; glue liquid is pumped into the glue storing tank through a glue material entering pipe; the glue liquid falls on a rubber sleeve through the gluedischarging soft nozzle under the gravity effect; a speed adjusting motor drives the rubber sleeve fixedly connected with an inner roller to rotate; because during installation of the gumming barrel,the gumming barrel and the rubber sleeve are pressed in a contact manner, when the speed adjusting motor rotates, the gumming barrel rotates together with the rubber sleeve, and therefore the glue liquid adsorbed on the surface of the rubber sleeve can be transmitted to the gumming barrel; when the gumming barrel makes contact with a PCB, the glue liquid is uniformly coated on the surface of the PCB through a glue storing groove formed in the gumming barrel; the glue liquid attached to the surface of the inner roller can be flattened by the glue scraping plate, it is prevented that large-blockglue liquid falls along with the inner roller; and the glue liquid attached to the surface of the gumming barrel can be flattened by a material scraping part, and it is prevented that large-block glue liquid falls. The device is simple in structure, can make the glue liquid uniformly coated on the surface of the PCB, and increases the PCB making yield.

Description

technical field [0001] The invention relates to a mechanical device, in particular to a PCB board gluing mechanism. Background technique [0002] PCB multi-layer board refers to a multi-layer circuit board used in electrical products. Generally, it is a printed circuit board in which single-sided or double-sided boards are alternately connected together through a positioning system and insulating bonding materials, and the conductive patterns are interconnected according to design requirements. Such as four-layer and six-layer printed circuit boards, in the process of making PCB multilayer boards, it is necessary to coat the adhesive glue on the surface of the raw material board. In the existing method, a roller with bristles is often used to directly coat the glue. Since the direction of force bending when the bristles are in contact with the raw material board is uncertain, the glue absorbed on the bristles cannot be evenly coated on the surface of the raw material board. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C1/08
CPCB05C1/0808B05C1/0813B05C1/0817
Inventor 蒋华芳
Owner SUZHOU YILIHUA ELECTRONICS CO LTD