Detection method and device of surface-mounted bonding pad

Abstract

The invention provides a detection method of a surface-mounted bonding pad. The detection method comprises the following steps of obtaining a first width value of the surface-mounted bonding pad and asecond width value of a connection line communicated with the surface-mounted bonding pad from a design file of a printed circuit board; when it is determined that the second width value and the first width value do not conform to a preset condition, regarding that the surface-mounted bonding pad fails the detection. By means of the detection method of the surface-mounted bonding pad, all detection surface-mounted bonding pads can be automatically detected, thus the problems can be quickly located, the correction time is greatly shortened, the work efficiency is improved, the risk of poor welding is avoided, and the product yield rate is increased.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a detection method and device for surface mount pads. Background technique [0002] Usually, a PCB (Printed Circuit Board, printed circuit board) is provided with pads and wiring for connecting multiple pads, wherein the pads may be surface mount pads. When soldering electronic components, in order to prevent the heat dissipation from being too fast and the temperature of the solder to cool down too fast, resulting in virtual soldering; at the same time, in order to prevent the solder mask from being insufficiently precise, causing the solder to flow, which may increase the risk of short circuit; surface mount pads are required The width of is greater than the width of the connecting line. Therefore, in the design stage of the PCB board, it is necessary to ensure that the width of all surface mount pads is greater than the width of the connection line connected to...

AI Technical Summary

Problems solved by technology

Therefore, in the design stage of the PCB board, it is necessary to ensure that the width of all surface mount pads is greater than the width of the connection line connected to it (for example, if figure 1 As shown, the width of the first connection line 11 is smaller than the width of the first surface mount pad 12, which meets the requirements; while the width of the second connection line 21 is greater than the width of the second surface mount pad 22, which does not meet the requirements), In the prior art, the designer usually conducts the detection manually. Since the number of surface mount pads is generally relatively large, it may cause missed detection and the efficiency is low.

Images