A kind of graphene heat conduction film and preparation method thereof
A technology of graphene and thermal conductive film, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc. Effective in promotion and application, easy to operate, and stable product quality
Active Publication Date: 2019-11-08
信骅(上海)器材有限公司
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Problems solved by technology
[0003] At present, some products in the market use metal materials for heat conduction and heat dissipation, especially copper and aluminum. Although the thermal conductivity of copper is 398W / mK, its heavy weight and easy oxidation limit its application, while the thermal conductivity of aluminum is 237W / mK. , it is difficult to meet the needs of existing products for heat conduction and heat dissipation
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower" and "horizontal" are based on the orientation or positional relationship shown in the drawings, and are only for It is convenient to describe the present invention and simplify the description, but does not indicate or imply that the device or element referred to must have a specific orientati...
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Abstract
The invention discloses a graphene heat-conducting film and a preparation method thereof. The graphene heat-conducting film includes a PET film, a PI plastic film and an inner heat-conducting layer. The inner heat-conducting layer includes heat-conducting wires, graphene placing positions and graphenes. The graphenes are located inside the graphene placement positions, the heat conducting wires are arranged among the graphene placement positions, and the heat conducting wires are in a curved arrangement. The graphene heat-conducting film and the preparation method have the advantages of simpleprocess, convenient operation, stable quality of an obtained product and a good effect and are suitable for popularization and application. The heat-conducting effect of the graphene heat-conductingfilm is better than that of single-layer and double-layer graphite films, the graphene heat-conducting film has flexibility and can be curled and stored, the heat conduction effect is good, and the graphene heat-conducting film is convenient to use and can be widely applied to a notebook computer, a mobile phone, a television set, a camera, an LED lamp, an automotive heat sink and other equipment.
Description
technical field [0001] The invention relates to the technical field of graphene material-related substances and preparation methods thereof, in particular to a graphene heat conduction film and a preparation method thereof. Background technique [0002] With the rapid development of modern technology, the miniaturization of electronic devices, the continuous increase of the main frequency of the chip, the increasing function, and the gradual increase of the power consumption of a single chip, all of these lead to a sharp increase in heat flux. Studies have shown that more than 55% of electronic devices fail in the form of overheating, so the heat dissipation of electronic devices plays a decisive role in the development of electronic devices. [0003] At present, some products in the market use metal materials for heat conduction and heat dissipation, especially copper and aluminum. Although the thermal conductivity of copper is 398W / mK, its heavy weight and easy oxidation l...
Claims
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IPC IPC(8): H01L23/367H01L23/373H01L21/48
CPCH01L21/4871H01L23/3672H01L23/3735H01L23/3738
Inventor 朱洋邵蓉
Owner 信骅(上海)器材有限公司