Production method for front uncovering protection of soft board of rigid-flex board
A soft-rigid combination board and cover-opening protection technology, which is used in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc. The effect of abnormal damage, improving product yield, and improving factory process capabilities
Inactive Publication Date: 2018-03-27
高德(江苏)电子科技股份有限公司
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[0002] With the continuous development of science and technology, thinner, lighter and smaller products are becoming more and more common. Customers have higher and higher requirements for printed circuit boards. In order to reduce the connector between soft boards and hard boards, further optimize the combination of soft and hard. Board, now the length of soft and hard boards is getting smaller and smaller, and the overall product is getting thinner and thinner. At this stage, the industry FPCB (that is, soft and hard printed circuit boards) requires higher and higher precision products, and the gap between layers The dielectric layer is required to be thinner and thinner, and ordinary rear opening can not meet the requirements. During the production process of ordinary front opening, because the soft board and the copper skin are separated, the soft board copper skin will be broken or broken during the ultrasonic process such as brushing film. Shatter abnormal
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[0018] The present invention will be further described below in conjunction with the accompanying drawings.
[0019] The ink of the ink layer in the present invention is purchased from Kunshan Maijie Electronic Technology Co., Ltd., and the model is SGC2500.
[0020] A kind of production method of front opening cover protection soft board of soft and hard combination board, such as Figure 1-3 shown, including the following steps:
[0021] (1) Take the pre-prepared semi-finished soft-rigid board, the semi-finished soft-hard board includes the middle soft board substrate 1, the upper surface and the lower surface of the flexible board substrate 1 are respectively provided with the first soft board copper foil 2 , the second soft board copper foil 3, the first cover film 4 is arranged on the outside of the first soft board copper foil 2, the second cover film 5 is arranged on the outside of the second soft board copper foil 3, and the flexible board semi-finished product The p...
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The invention relates to a production method for the front uncovering protection of a soft board of a rigid-flex board, and the method comprises the steps: firstly setting an ink layer in a soft boardregion of a rigid-flex board semi-finished product prepared in advance; secondly carrying out the windowing of the parts, corresponding to a first prepreg and a second prepreg, of the soft board region; thirdly carrying out the drilling, electroplating and pattern transfer of the rigid-flex board after stitching, and then carrying out the etching; removing first and second hard board copper foilon the surface of the soft board through etching, and finally removing the ink layer to expose the soft board region. The method is simple, and the steps are easy to execute. The method improves a phenomenon of the damage abnormality of the surface copper of a conventional front uncovering soft board, improves the process capability of a factory, and improves the yield.
Description
technical field [0001] The invention relates to a production method of a flexible board with a front opening cover protection soft board, which belongs to the technical field of printed circuit boards. Background technique [0002] With the continuous development of science and technology, thinner, lighter and smaller products are becoming more and more common. Customers have higher and higher requirements for printed circuit boards. In order to reduce the connector between soft boards and hard boards, further optimize the combination of soft and hard. Board, now the length of soft and hard boards is getting smaller and smaller, and the overall product is getting thinner and thinner. At this stage, the industry FPCB (that is, soft and hard printed circuit boards) requires higher and higher precision products, and the gap between layers The dielectric layer is required to be thinner and thinner, and the ordinary rear opening can not meet the requirements. During the productio...
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IPC IPC(8): H05K3/46
CPCH05K3/4691H05K2203/068
Inventor 闫诚鑫张志敏
Owner 高德(江苏)电子科技股份有限公司