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Lamp

A lamp and lampshade technology, which is applied in the field of lamps using semiconductor light-emitting components, can solve the problems of poor heat dissipation, environmental protection, and affecting the service life of lamps, etc., achieve good waterproof effect, and improve the effect of optical effects

Pending Publication Date: 2018-03-30
YANGZHOU LEDLINK OPTICS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The main body of existing projection lamps is mostly made of glass material, and the inner surface of the main body is coated with a reflective aluminum layer to reflect light. Such a structure is not only not environmentally friendly but also has a poor heat dissipation effect, thus affecting the service life of the lamp.
In addition, most of the existing projection lamps use glass lenses, and the lenses are bonded to the main body with glue, which will cause safety problems due to the degumming of the components during use.

Method used

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Examples

Experimental program
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Embodiment Construction

[0024] see figure 1 and figure 2 , which represents an embodiment of the lamp of the present invention. The lamp 100 of the present invention includes a semiconductor light emitting component 110 , a carrier 120 and a covering 130 . The carrier 120 carries the semiconductor light emitting component 110, the covering part 130 covers the semiconductor light emitting component 110 and the carrier 120 and has a first lens 132 covering the semiconductor light emitting component 110, wherein the covering part 130 is an integrally formed structure, and the semiconductor light emitting The light emitted by the component 110 passes through the first lens 132 . In this embodiment, the covering member 130 has a top 134 , and a recess 136 is formed on the top 134 , and the first lens 132 is disposed in the recess 136 and located above the semiconductor light emitting device 110 .

[0025] In this embodiment, the covering member 130 can integrally encapsulate the semiconductor light em...

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PUM

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Abstract

The invention discloses a lamp. The lamp comprises a semiconductor light emitting module, a bearing piece and a coating piece. The bearing piece bears the semiconductor light emitting module; the coating piece coats the semiconductor light emitting module and the bearing piece, and is provided with a first lens for covering the semiconductor light emitting module; the coating piece is of an integrally-molded structure; light rays emitted by the semiconductor light emitting module pass through the first lens; the structure that the coating piece coats the semiconductor light emitting module andthe bearing piece is formed by using an integral molding mode, so that the component falling problem caused by degumming cannot occur; and in addition, as the structure that the coating piece coats the semiconductor light emitting module and the bearing piece, the excellent waterproof effect also can be achieved.

Description

technical field [0001] The invention relates to a lamp, in particular to a lamp using a semiconductor light-emitting component. Background technique [0002] The main body of existing projection lamps is mostly made of glass, and the inner surface of the main body is coated with a reflective aluminum layer to reflect light. Such a structure is not only not environmentally friendly but also has a poor heat dissipation effect, thus affecting the service life of the lamp. In addition, most of the existing projection lamps use glass lenses, and the lenses are bonded to the main body with glue. During use, the components will fall off due to degumming, which will cause safety problems. Contents of the invention [0003] The object of the present invention is to provide a lamp, which encapsulates the light source and the electronic components related to the light source by integrally forming the covering part. Since such a structure does not use adhesive bonding, there will be n...

Claims

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Application Information

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IPC IPC(8): F21K9/20F21V3/04F21V5/04F21V7/04F21V29/83H01L33/52H01L33/58H01L33/64F21Y115/10
CPCH01L33/52H01L33/58H01L33/64F21V5/04F21V7/041F21V29/83
Inventor 唐德龙陈弘滨
Owner YANGZHOU LEDLINK OPTICS
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