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Substrate processing apparatus and substrate processing method

A substrate processing device and technology for substrates, which are applied in chemical instruments and methods, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve problems such as differences in processing liquids, difficulty in evaporation, and control of the concentration of processing liquids within a suitable range.

Active Publication Date: 2021-12-24
DAINIPPON SCREEN MTG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art as described above, a concentration meter is arranged in the circulation line, and the concentration of the treatment liquid present in the circulation line is measured, but there is a problem that the measured value obtained by the concentration meter is subject to processing in the circulation line. However, the apparent concentration of the processing liquid is controlled to a target value by using feedback control or the like, and the actual concentration of the processing liquid may differ from the apparent concentration as time goes by. Happening
[0005] In addition, in the case where the treatment liquid is composed of a plurality of chemical reagents and pure water, there are components that are easily evaporated and components that are not easily evaporated in the components of the treatment liquid, so the concentration is determined without considering the difference in volatility of each component. Control, sometimes it is difficult to control the concentration of the treatment solution within an appropriate range for the target treatment

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

Examples

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no. 1 example ＞

[0082] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the embodiment shown below is a solution of the invention of the present application, and does not limit the technical scope of the invention of the present application. figure 1 It is a perspective view showing a schematic configuration of the substrate processing apparatus 1 of the first embodiment. This substrate processing apparatus 1 is an apparatus for performing etching processing and cleaning processing (hereinafter, also simply referred to as "processing") on a substrate W mainly. In the substrate processing apparatus 1 figure 1 A buffer unit 2 for storing substrates W is disposed on the right inner side of the buffer unit 2, and a front panel (not shown) for operating the substrate processing apparatus 1 is provided on the further right inner side of the buffer unit 2. In addition, on the side of the buffer unit 2 opposite to ...

no. 2 example ＞

[0111] Next, a second embodiment of the present invention will be described. In the first embodiment, in contrast to making the change amount of the increase of the lower reference value of the concentration control of the mixed acid aqueous solution constant and controlling based on the change time, in the second embodiment of the present invention, while controlling the mixing The change width of the lower reference value of the concentration control of the aqueous acid solution is different in controlling it.

[0112] exist Figure 9 , after the initial change start delay time of 60 minutes (3600 seconds), set the interval time for changing the lower reference value of the concentration control to 90 minutes (5400 seconds), and for the first two intervals, at each interval Set the increase range (offset) of D (W%), after the third and fourth intervals, set the increase range (offset) of 2*D (W%), and then temporarily stop A change in the lower reference value of the densi...

no. 3 example ＞

[0115] Next, a third embodiment of the present invention will be described. In the third embodiment, an example in which the increase in the lower reference value of the concentration control of the mixed acid aqueous solution is controlled in relation to the throughput of the substrate W will be described.

[0116] In this embodiment, for example Figure 11 As shown, it is also possible to increase the lower reference value of the concentration control of the mixed acid aqueous solution at every pure water replenishment timing. exist Figure 11 In the figure, the vertical axis represents the lower reference value (W%) of pure water concentration control, and the horizontal axis represents time. In addition, the pulse-shaped display at the lower part of the graph is the time to replenish pure water. Here, pure water is replenished in many cases immediately after the substrate W is processed in the processing tank 7a, and a high correlation is observed between the timing of ...

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Abstract

A substrate processing apparatus and a substrate processing method capable of more reliably maintaining the concentration of a processing liquid in a processing tank at a concentration suitable for processing performed in the processing tank in the substrate processing apparatus or substrate processing method. A substrate processing device, which is a substrate processing device for etching a substrate by immersing a substrate in a mixed acid aqueous solution, comprising: a processing tank storing the mixed acid aqueous solution; The action period of the acid aqueous solution is to replace the mixed acid aqueous solution; the detection part is used to detect the concentration of pure water in the mixed acid aqueous solution; the concentration control part is based on the pure water concentration detected by the detection part. Pure water is supplied to control the concentration of the pure water so that the concentration becomes a predetermined target concentration; and a target value changing unit changes a lower reference value (target concentration).

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for immersing a substrate such as a semiconductor wafer in a processing liquid stored in a processing tank to perform etching and cleaning, and particularly relates to concentration control of the processing liquid in the processing tank. Background technique [0002] The manufacturing process of a semiconductor device includes a process of immersing a substrate such as a semiconductor wafer in a treatment tank, and performing an etching process and a cleaning process on the substrate. Such steps are performed using a substrate processing apparatus including a plurality of processing tanks. The concentration of the processing liquid in each processing tank of the substrate processing apparatus may change over time due to evaporation, decomposition, etc. of the constituent components of the processing liquid. Concentration control within the scope of tre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/306H01L21/02
CPCH01L21/02057H01L21/30604H01L21/67057H01L21/67086H01L21/32134H01L21/67253H01L21/67242H01L21/02052H01L22/10C09K13/00C09K13/04H01L22/26
Inventor 杉冈真治
Owner DAINIPPON SCREEN MTG CO LTD
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